Dental Research Center, Mazandaran University of Medical Sciences, Sari, Iran.
Orthodontic Department, Faculty of Dentistry, Mazandaran University of Medical Sciences, Sari, Iran.
BMC Oral Health. 2024 Jul 25;24(1):843. doi: 10.1186/s12903-024-04364-w.
This study aimed to compare the intra and postoperative complications of frenectomy procedure with a surgical scalpel versus 445 nm and 980 nm diode lasers.
This randomized controlled clinical trial was conducted on 174 patients requiring maxillary labial frenectomy. After completion of fixed orthodontic treatment and primary closure of maxillary diastema, the patients were randomly assigned into three groups (n = 58): group 1 (frenectomy via 445 nm diode laser, continuous-wave, 1.5 W), group 2 (frenectomy via 980 nm laser, continuous-wave, 1.7 W), and control group (V-Y plasty technique via scalpel). Intra-operative bleeding, discomfort in chewing and speaking, pain, and tissue healing were compared among the groups immediately, at 7 and 30 days postoperatively using the Kruskal-Wallis, Mann-Whitney, and Chi-square tests.
Pain scores were significantly lower in group 1 compared to group 2 (immediately and day 7, P < 0.05). Significant faster tissue healing at days 7 and 30 were observed in group 1 compared to group 2 (P < 0.05). Group 1 was superior to the control group regarding lower intraoperative bleeding, discomfort in chewing and speaking (immediately and day 7), lower pain (immediately and day 7), and tissue healing (day 7) (P < 0.05 for all). Group 2 was significantly superior to the control group in lower intraoperative bleeding, discomfort in chewing and speaking (immediately and day 7), and better tissue healing (day 7) (P < 0.05 for all).
In conclusion, diode laser frenectomy resulted in significantly lower intra and postoperative complications compared to the scalpel. Moreover, 445 nm diode laser showed significantly superior effects compared to 980 nm diode laser.
The study protocol was registered on 29.10.2022 at the Iranian Registry of Clinical Trials ( www.irct.ir ) (registration number: IRCT20220630055326N1).
本研究旨在比较唇系带切除术采用手术手术刀与 445nm 和 980nm 半导体激光的术中及术后并发症。
这是一项随机对照临床试验，纳入了 174 名需要行上颌唇系带切除术的患者。在完成固定正畸治疗和上颌间隙的一期关闭后，患者被随机分为三组（n=58）：第 1 组（445nm 半导体激光连续波，1.5W）、第 2 组（980nm 激光连续波，1.7W）和对照组（手术刀 V-Y 成形术）。使用 Kruskal-Wallis、Mann-Whitney 和 Chi-square 检验比较各组患者术中出血、咀嚼和说话时的不适、疼痛和组织愈合情况，分别在术后即刻、第 7 天和第 30 天进行评估。
第 1 组患者的疼痛评分在术后即刻和第 7 天均显著低于第 2 组（P<0.05）。第 1 组在术后第 7 天和第 30 天的组织愈合速度明显快于第 2 组（P<0.05）。第 1 组在术中出血、咀嚼和说话时的不适、疼痛以及组织愈合方面（术后即刻和第 7 天）均优于对照组（P<0.05）。第 2 组在术中出血、咀嚼和说话时的不适、疼痛以及组织愈合方面（术后即刻和第 7 天）均优于对照组（P<0.05）。
总之，与手术刀相比，半导体激光唇系带切除术可显著降低术中及术后并发症。此外，445nm 半导体激光的效果明显优于 980nm 半导体激光。
该研究方案于 2022 年 10 月 29 日在伊朗临床试验注册中心（ www.irct.ir ）（注册号：IRCT20220630055326N1）注册。
