Shi Shu, Cao Tengfei, Xi Haolong, Niu Jiangzhen, Jing Xixiang, Su Hanxin, Yu Xiaojiang, Yang Ping, Wu Yichen, Yan Xiaobing, Tian He, Tsymbal Evgeny Y, Chen Jingsheng
Department of Materials Science and Engineering, <a href="https://ror.org/01tgyzw49">National University of Singapore</a>, 117575 Singapore, Singapore.
Department of Materials Science and Engineering, <a href="https://ror.org/01y0j0j86">Northwestern Polytechnical University</a>, Xian 710072, China.
Phys Rev Lett. 2024 Jul 19;133(3):036202. doi: 10.1103/PhysRevLett.133.036202.
Ferroelectric hafnia-based thin films have attracted significant interest due to their compatibility with complementary metal-oxide-semiconductor technology (CMOS). Achieving and stabilizing the metastable ferroelectric phase in these films is crucial for their application in ferroelectric devices. Recent research efforts have concentrated on the stabilization of the ferroelectric phase in hafnia-based films and delving into the mechanisms responsible for this stability. In this study, we experimentally demonstrate that stabilization of the ferroelectric phase in Hf_{0.5}Zr_{0.5}O_{2} (HZO) can be controlled by the interfacial charge transfer and the associated hole doping of HZO. Using the meticulously engineered charge transfer between an La_{1-x}Sr_{x}MnO_{3} buffer layer with variable Sr concentration x and an HZO film, we find the optimal x=0.33 that provides the required hole doping of HZO to most efficiently stabilize its ferroelectric phase. Our theoretical modeling reveals that the competition of the hole distribution between the threefold and fourfold coordinated oxygen sites in HZO controls the enhancement or reduction of the ferroelectric phase. Our findings offer a novel strategy to stabilize the ferroelectric phase of hafnia-based films and provide new insights into the development of ferroelectric devices compatible with CMOS.
铁电铪基薄膜因其与互补金属氧化物半导体技术(CMOS)的兼容性而备受关注。在这些薄膜中实现并稳定亚稳铁电相对于其在铁电器件中的应用至关重要。最近的研究工作集中在基于铪的薄膜中铁电相的稳定化,并深入研究这种稳定性的相关机制。在本研究中,我们通过实验证明,Hf₀.₅Zr₀.₅O₂(HZO)中铁电相的稳定化可以通过界面电荷转移和HZO相关的空穴掺杂来控制。利用具有可变Sr浓度x的La₁₋ₓSrₓMnO₃缓冲层与HZO薄膜之间精心设计的电荷转移,我们发现最佳x = 0.33,它能为HZO提供所需的空穴掺杂,以最有效地稳定其铁电相。我们的理论模型表明,HZO中三重和四重配位氧位点之间空穴分布的竞争控制着铁电相的增强或减弱。我们的研究结果为稳定铪基薄膜的铁电相提供了一种新策略,并为与CMOS兼容的铁电器件的开发提供了新的见解。