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Simultaneous Characterization of In-Plane and Cross-Plane Resistivities in Highly Anisotropic 2D Layered Heterostructures.

作者信息

Weng Sizhe, Wang Yu, Price Celsey, Blackwood Hannah R, Choffel Marisa, Miller Aaron, Li Ruoxi, Chen Mingrui, Lu Ping, Ilkhani Sina, Majumdar Arun, Johnson David C, Cronin Stephen B

机构信息

Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, California 90089, United States.

Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, California 90089, United States.

出版信息

ACS Nano. 2024 Sep 17;18(37):25405-25413. doi: 10.1021/acsnano.3c13232. Epub 2024 Sep 2.

Abstract

Understanding and characterizing the intrinsic properties of charge carrier transport across the interfaces in van der Waals heterostructures is critical to their applications in modern electronics, thermoelectrics, and optoelectronics. However, there are very few published cross-plane resistivity measurements of thin samples because these inherently 2-probe measurements must be corrected for contact and lead resistances. Here, we present a method to extract contact resistances and metal lead resistances by fitting the width dependence of the contact end voltages of top and bottom electrodes of different contact widths to a model based on current crowding. These contributions are then subtracted from the total 2-probe cross-plane resistance to obtain the cross-plane resistance of the material itself without needing multiple devices and/or etching steps. This approach was used to measure cross-plane resistivities of a (PbSe)(VSe) heterostructure containing alternating layers of PbSe and VSe with random in-plane rotational disorder. Several samples measured exhibited a 4 order of magnitude difference between cross-plane and in-plane resistivities over the 6-300 K temperature range. We also reported the observation of charge density wave transition in the cross-plane transport of the (PbSe)(VSe) heterostructure. The device fabrication process is fully liftoff compatible, and the method developed enables the straightforward measurement of the resistivity anisotropy of most thin film materials with nm thicknesses.

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