Oswald Jacopo, Beretta Davide, Stiefel Michael, Furrer Roman, Romio Alessia, Mansour Michel Daher, Vuillaume Dominique, Calame Michel
Transport at Nanoscale Interfaces Laboratory, EMPA, Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, DübendorfCH-8600, Switzerland.
Swiss Nanoscience Institute, University of Basel, Klingelbergstrasse 82, BaselCH-4056, Switzerland.
ACS Appl Mater Interfaces. 2022 Oct 26;14(42):48240-48249. doi: 10.1021/acsami.2c13148. Epub 2022 Oct 14.
Hybrid van der Waals heterostructures based on 2D materials and/or organic thin films are being evaluated as potential functional devices for a variety of applications. In this context, the graphene/organic semiconductor (Gr/OSC) heterostructure could represent the core element to build future vertical organic transistors based on two back-to-back Gr/OSC diodes sharing a common graphene sheet, which functions as the base electrode. However, the assessment of the Gr/OSC potential still requires a deeper understanding of the charge carrier transport across the interface as well as the development of wafer-scale fabrication methods. This work investigates the charge injection and transport across Au/OSC/Gr vertical heterostructures, focusing on poly(3-hexylthiophen-2,5-diyl) as the OSC, where the PMMA-free graphene layer functions as the top electrode. The structures are fabricated using a combination of processes widely exploited in semiconductor manufacturing and therefore are suited for industrial upscaling. Temperature-dependent current-voltage measurements and impedance spectroscopy show that the charge transport across both device interfaces is injection-limited by thermionic emission at high bias, while it is space charge limited at low bias, and that the P3HT can be assumed fully depleted in the high bias regime. From the space charge limited model, the out-of-plane charge carrier mobility in P3HT is found to be equal to μ ≈ 2.8 × 10 cm V s, similar to the in-plane mobility reported in previous works, while the charge carrier density is ≈ 1.16 × 10 cm, also in agreement with previously reported values. From the thermionic emission model, the energy barriers at the Gr/P3HT and Au/P3HT interfaces result in 0.30 eV and 0.25 eV, respectively. Based on the measured barriers heights, the energy band diagram of the vertical heterostructure is proposed under the hypothesis that P3HT is fully depleted.
基于二维材料和/或有机薄膜的混合范德华异质结构正被评估为适用于各种应用的潜在功能器件。在此背景下,石墨烯/有机半导体(Gr/OSC)异质结构可能是构建未来垂直有机晶体管的核心元件,该晶体管基于两个背对背的Gr/OSC二极管,共享一个用作基极的公共石墨烯片。然而,对Gr/OSC潜力的评估仍需要更深入地了解电荷载流子在界面上的传输以及晶圆级制造方法的开发。这项工作研究了电荷在Au/OSC/Gr垂直异质结构中的注入和传输,重点关注以聚(3 - 己基噻吩 - 2,5 - 二基)作为OSC,其中无聚甲基丙烯酸甲酯的石墨烯层用作顶部电极。这些结构是使用半导体制造中广泛采用的多种工艺组合制造的,因此适合工业放大生产。温度相关的电流 - 电压测量和阻抗谱表明,在高偏压下,跨两个器件界面的电荷传输受热电子发射的注入限制,而在低偏压下受空间电荷限制,并且在高偏压区域可以假设P3HT完全耗尽。从空间电荷限制模型可知,P3HT中的面外电荷载流子迁移率等于μ≈2.8×10⁻⁴ cm² V⁻¹ s⁻¹,与先前工作中报道的面内迁移率相似,而电荷载流子密度为≈1.16×10¹⁷ cm⁻³,也与先前报道的值一致。从热电子发射模型可知,Gr/P3HT和Au/P3HT界面处的能垒分别为0.30 eV和0.25 eV。基于测量的势垒高度,在P3HT完全耗尽的假设下提出了垂直异质结构的能带图。