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空位填充型赫斯勒热电半导体的战略设计与机理理解

Strategic Design and Mechanistic Understanding of Vacancy-Filling Heusler Thermoelectric Semiconductors.

作者信息

Hu Weimin, Ye Song, Li Qizhu, Zhao Binru, Hagihala Masato, Dong Zirui, Zhang Yubo, Zhang Jiye, Torri Shuki, Ma Jie, Ge Binghui, Luo Jun

机构信息

School of Materials Science and Engineering, Shanghai University, Shanghai, 200444, China.

Institutes of Physical Science and Information Technology, Anhui University, 111 Jiulong Road, Hefei, 230601, China.

出版信息

Adv Sci (Weinh). 2024 Oct;11(40):e2407578. doi: 10.1002/advs.202407578. Epub 2024 Sep 3.

Abstract

Doping narrow-gap semiconductors is a well-established approach for designing efficient thermoelectric materials. Semiconducting half-Heusler (HH) and full-Heusler (FH) compounds have garnered significant interest within the thermoelectric field, yet the number of exceptional candidates remains relatively small. It is recently shown that the vacancy-filling approach is a viable strategy for expanding the Heusler family. Here, a range of near-semiconducting Heuslers, TiFeCuSb, creating a composition continuum that adheres to the Slater-Pauling electron counting rule are theoretically designed and experimentally synthesized. The stochastic and incomplete occupation of vacancy sites within these materials imparts continuously changing electrical conductivities, ranging from a good semiconductor with low carrier concentration in the endpoint TiFeCuSb to a heavily doped p-type semiconductor with a stoichiometry of TiFeCuSb. The optimal thermoelectric performance is experimentally observed in the intermediate compound TiFeCuSb, achieving a peak figure of merit of 0.87 at 923 K. These findings demonstrate that vacancy-filling Heusler compounds offer substantial opportunities for developing advanced thermoelectric materials.

摘要

掺杂窄带隙半导体是设计高效热电材料的一种成熟方法。半导体半赫斯勒(HH)和全赫斯勒(FH)化合物在热电领域引起了广泛关注,但优异的候选材料数量仍然相对较少。最近表明,空位填充方法是扩展赫斯勒家族的一种可行策略。在此,理论上设计并通过实验合成了一系列近半导体赫斯勒化合物TiFeCuSb,形成了符合斯莱特-鲍林电子计数规则的成分连续体。这些材料中空位位置的随机和不完全占据赋予了不断变化的电导率,范围从端点TiFeCuSb中具有低载流子浓度的良好半导体到化学计量比为TiFeCuSb的重掺杂p型半导体。在中间化合物TiFeCuSb中通过实验观察到了最佳热电性能,在923 K时实现了0.87的峰值优值。这些发现表明,空位填充赫斯勒化合物为开发先进热电材料提供了大量机会。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d504/11516113/86e3a260dd2c/ADVS-11-2407578-g003.jpg

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