Dreimol Christopher H, Kürsteiner Ronny, Ritter Maximilian, Parrilli Annapaola, Edberg Jesper, Garemark Jonas, Stucki Sandro, Yan Wenqing, Tinello Susanna, Panzarasa Guido, Burgert Ingo
Wood Materials Science, Institute for Building Materials, ETH Zürich, Zürich, 8093, Switzerland.
Cellulose & Wood Materials Laboratory, Empa - Swiss Federal Laboratories for Materials Science and Technology, Dübendorf, 8600, Switzerland.
Small. 2024 Dec;20(49):e2405558. doi: 10.1002/smll.202405558. Epub 2024 Sep 16.
The transition to sustainable materials and eco-efficient processes in commercial electronics is a driving force in developing green electronics. Iron-catalyzed laser-induced graphitization (IC-LIG) has been demonstrated as a promising approach for rendering biomaterials electrically conductive. To optimize the IC-LIG process and fully exploit its potential for future green electronics, it is crucial to gain deeper insights into its catalyzation mechanism and structural evolution. However, this is challenging due to the rapid nature of the laser-induced graphitization process. Therefore, multiscale preparation techniques, including ultramicrotomy of the cross-sectional transition zone from precursor to fully graphitized IC-LIG electrode, are employed to virtually freeze the IC-LIG process in time. Complementary characterization is performed to generate a 3D model that integrates nanoscale findings within a mesoscopic framework. This enabled tracing the growth and migration behavior of catalytic iron nanoparticles and their role during the catalytic laser-graphitization process. A three-layered arrangement of the IC-LIG electrode is identified including a highly graphitized top layer with an interplanar spacing of 0.343 nm. The middle layer contained γ-iron nanoparticles encapsulated in graphitic shells. A comparison with catalyst-free laser graphitization approaches highlights the unique opportunities that IC-LIG offers and discuss potential applications in energy storage devices, catalysts, sensors, and beyond.
商业电子产品向可持续材料和生态高效工艺的转变是推动绿色电子产品发展的一股力量。铁催化激光诱导石墨化(IC-LIG)已被证明是一种使生物材料具有导电性的有前途的方法。为了优化IC-LIG工艺并充分挖掘其在未来绿色电子产品中的潜力,深入了解其催化机制和结构演变至关重要。然而,由于激光诱导石墨化过程的快速性,这具有挑战性。因此,采用了多尺度制备技术,包括对从前体到完全石墨化的IC-LIG电极的横截面过渡区进行超薄切片,以便在时间上虚拟地冻结IC-LIG过程。进行了补充表征以生成一个三维模型,该模型将纳米级的研究结果整合到一个介观框架内。这使得能够追踪催化铁纳米颗粒的生长和迁移行为及其在催化激光石墨化过程中的作用。确定了IC-LIG电极的三层结构,包括一个高度石墨化的顶层,其面间距为0.343纳米。中间层包含包裹在石墨壳中的γ-铁纳米颗粒。与无催化剂激光石墨化方法的比较突出了IC-LIG所提供的独特机遇,并讨论了其在储能设备、催化剂、传感器及其他领域的潜在应用。