Cheng Qing, Li Ning, Wu Bo, Pan Qinmin, Zheng Zhen, Han Xinchen, Ding Qiao, Zhao Qi, Xu Rongguo, Li Deyu
School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150001, P.R. China.
Center for Analysis Measurement and Computing, Harbin Institute of Technology, Harbin 150001, P.R. China.
Langmuir. 2024 Oct 15;40(41):21366-21376. doi: 10.1021/acs.langmuir.4c01831. Epub 2024 Oct 6.
The electrochemical behavior of three types of bisphenol A polyoxyethylene ether sodium sulfate (BPA) is investigated through cyclic voltammetry striping tests. The results indicate that BPA-25 exhibited the most significant inhibition of Cu deposition. The nanotwinned Cu (nt-Cu) films are prepared by direct current electrodeposition in an acidic Cu sulfate bath containing a combination of conventional bath additives. Transmission electron microscopy (TEM) and cross-sectional scanning electron microscopy (SEM) results revealed that nt-Cu consisted of microcolumnar grains with high-density nanoscale coherent twin boundaries oriented parallel to the growth surface. The interaction between BPA-25 and the poly2-sulfur-2-propane sodium sulfonate (SPS) was further analyzed through galvanostatic measurements (GMs) and electron backscatter diffraction (EBSD). The results demonstrate that BPA-25 and SPS underwent competitive adsorption on the cathode surface, leading to the formation of nt-Cu. This growth mechanism provides a new perspective for the preparation of nt-Cu by using direct current electrodeposition.
通过循环伏安溶出试验研究了三种双酚A聚氧乙烯醚硫酸钠（BPA）的电化学行为。结果表明，BPA-25对铜沉积的抑制作用最为显著。通过在含有传统镀液添加剂组合的酸性硫酸铜镀液中进行直流电沉积制备了纳米孪晶铜（nt-Cu）薄膜。透射电子显微镜（TEM）和横截面扫描电子显微镜（SEM）结果表明，nt-Cu由微柱状晶粒组成，这些晶粒具有与生长表面平行的高密度纳米级相干孪晶界。通过恒电流测量（GMs）和电子背散射衍射（EBSD）进一步分析了BPA-25与聚2-硫代-2-丙烷磺酸钠（SPS）之间的相互作用。结果表明，BPA-25和SPS在阴极表面发生竞争吸附，从而导致nt-Cu的形成。这种生长机制为利用直流电沉积制备nt-Cu提供了新的视角。
