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通过动态共价化学和氢键协同构建高介电聚间苯二甲酰间苯二胺/二氧化硅/纤维素纳米纤维复合绝缘纸

Synergistically Constructing High-Dielectric Poly(-phenylene isophthalamide)/Silica/Cellulose Nanofiber Composite Insulation Paper through Dynamic Covalent Chemistry and Hydrogen Bonding.

作者信息

Liu Jinke, Li Jinpeng, Li Yongfeng, Yin Shengdong, Xu Jun, Wang Bin, Zeng Jinsong, Gao Wenhua, Chen Kefu

机构信息

Plant Fiber Material Science Research Center, State Key Laboratory of Pulp and Paper Engineering, South China University of Technology, Guangzhou, Guangdong 510640, People's Republic of China.

Aramid Material Science and Engineering Technology Innovation Center of Jiangxi Province, Ganzhou Longpont Materials Technology Company, Limited, Futian Industrial Park of Dingnan County, Ganzhou, Jiangxi 341900, People's Republic of China.

出版信息

ACS Appl Mater Interfaces. 2024 Oct 23;16(42):57738-57745. doi: 10.1021/acsami.4c13783. Epub 2024 Oct 9.

Abstract

The rapid advancement of modern power equipment and high-power devices has imposed increasingly stringent demands upon the mechanical and dielectric properties of electrical insulation materials. Herein, we report a poly(-phenylene isophthalamide) (PMIA) composite insulating paper with excellent dielectric breakdown strength, reliable mechanical properties, and high thermal stability. Enhanced surface activity of PMIA is achieved through surface modification, facilitating the synergistic integration of modified PMIA (MPMIA), bovine serum albumin (BSA)/silica (SiO), and cellulose nanofiber (CNF) into composite paper using dynamic covalent bonds and hydrogen bonding. The prepared MPMIA-BSA/SiO-CNF composite paper exhibits a laminated stacked structure with high tensile strength (32.68 MPa) and strain at break (9.57%). Meanwhile, MPMIA-BSA/SiO-CNF composites have excellent dielectric breakdown strength (24.75 kV/mm) and good temperature resistance. Therefore, the MPMIA-BSA/SiO-CNF composite paper has a broad application prospect in the field of high-voltage and high-power electrical equipment insulation.

摘要

现代电力设备和大功率器件的快速发展,对电气绝缘材料的机械性能和介电性能提出了越来越严格的要求。在此,我们报道了一种具有优异介电击穿强度、可靠机械性能和高热稳定性的聚间苯二甲酰间苯二胺(PMIA)复合绝缘纸。通过表面改性提高了PMIA的表面活性,利用动态共价键和氢键促进了改性PMIA(MPMIA)、牛血清白蛋白(BSA)/二氧化硅(SiO)和纤维素纳米纤维(CNF)协同整合到复合纸中。制备的MPMIA-BSA/SiO-CNF复合纸呈现出层状堆叠结构,具有高拉伸强度(32.68 MPa)和断裂应变(9.57%)。同时,MPMIA-BSA/SiO-CNF复合材料具有优异的介电击穿强度(24.75 kV/mm)和良好的耐温性。因此,MPMIA-BSA/SiO-CNF复合纸在高压和大功率电气设备绝缘领域具有广阔的应用前景。

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