Rondonópolis Federal of University, Bachelor's Degree in Animal Science, Rondonópolis, Mato Grosso, Brazil.
State University of Goiás, Stricto Sensu Graduate Program in Agricultural Engineering, Anápolis, Goiás, Brazil.
Int J Biol Macromol. 2024 Nov;281(Pt 2):136378. doi: 10.1016/j.ijbiomac.2024.136378. Epub 2024 Oct 9.
The industrial use of corn starch competes with food supplies, encouraging the investigation of native starches as an alternative for its partial replacement. This study aimed to analyze the effects of replacing corn starch (CS) with wolf's fruit (WFS) and butterfly lily (BLS) starches on the physicochemical, mechanical, and biodegradation properties of starch-based films. Plasticized (with glycerin and citric acid) and unplasticized films were prepared with a microwave (10 s) and by thermopressing (1.5 t/120 °C/2 min) and were analyzed for amylose, scanning electron microscopy, X-ray diffraction, and paste properties. Furthermore, the biodegradability of films was tested in two soils over 42 days. Our results show that BLS is not a suitable raw material to replace corn starch. WFS with 27.5 % apparent amylose content and granule size of 12.5 μm produced films with thickness, permeability, tensile strength, and elongation of ~110 μm, ~4.8 g (m.s.Pa), ~2.5 MPa, and ~2.9 %, respectively, similar to CS. The biodegradability of WFS film showed greater resistance (≤61.4 %), increasing with the addition of plasticizers (89-93 % for WFS302) or partial replacement of CS (73-91 % for CSWFS303). These findings indicate that WFS can partially or fully replace CS in thermopressed films.
工业用玉米淀粉与食品供应竞争,鼓励研究天然淀粉作为其部分替代物。本研究旨在分析用狼莓(WFS)和百合(BLS)淀粉替代玉米淀粉(CS)对淀粉基薄膜的物理化学、机械和生物降解性能的影响。用甘油和柠檬酸增塑(10 秒微波处理)和未增塑的薄膜,并通过热压(1.5 t/120°C/2 min)制备,并分析直链淀粉、扫描电子显微镜、X 射线衍射和糊化特性。此外,还在两种土壤中测试了薄膜的生物降解性,为期 42 天。我们的结果表明,BLS 不是替代玉米淀粉的合适原料。WFS 的直链淀粉含量为 27.5%,颗粒大小为 12.5μm,可生产出厚度、渗透性、拉伸强度和伸长率分别约为 110μm、4.8g(m.s.Pa)、2.5MPa 和 2.9%的薄膜,与 CS 相似。WFS 薄膜的生物降解性表现出更大的阻力(≤61.4%),随着增塑剂的添加(WFS302 为 89-93%)或 CS 的部分替代(CSWFS303 为 73-91%)而增加。这些发现表明,WFS 可以部分或完全替代热压薄膜中的 CS。