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用于中红外光电子学的黑磷:光物理、可扩展加工及器件应用

Black Phosphorus for Mid-Infrared Optoelectronics: Photophysics, Scalable Processing, and Device Applications.

作者信息

Higashitarumizu Naoki, Wang Shu, Wang Shifan, Kim Hyungjin, Bullock James, Javey Ali

机构信息

Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, California 94720, United States.

Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States.

出版信息

Nano Lett. 2024 Oct 23;24(42):13107-13117. doi: 10.1021/acs.nanolett.4c04027. Epub 2024 Oct 15.

Abstract

High efficiency mid-infrared (λ = 3-8 μm) light emitters and photodetectors are pivotal for advancing next-generation optoelectronics. However, narrow-bandgap semiconductors face fundamental challenges such as pronounced nonradiative carrier recombination and thermally generated noise, which impede device performance. Recently, two-dimensional layered black phosphorus (BP) and its alloys have attracted substantial interest for mid-infrared device applications, demonstrating superior performance relative to conventional III-V and II-VI semiconductors with similar bandgaps. In this review, we discuss the optical properties of BP, contrasting these with those of covalent compounds. Owing to its inherently self-terminated surface structure and reduced nonradiative recombination, BP exhibits high performance in light emission and photodetection at room temperature. Furthermore, this review highlights recent advances in the large-area processing of BP thin films, paving the way for practical device applications and integration. Finally, we explore ongoing challenges and emerging opportunities in the utilization of BP for functional mid-infrared devices.

摘要

高效中红外(λ = 3 - 8μm)发光器和光电探测器对于推进下一代光电子学至关重要。然而,窄带隙半导体面临着诸如明显的非辐射载流子复合和热产生噪声等基本挑战,这阻碍了器件性能。最近,二维层状黑磷(BP)及其合金在中红外器件应用中引起了极大的兴趣,相对于具有相似带隙的传统III - V族和II - VI族半导体表现出优异的性能。在这篇综述中,我们讨论了BP的光学性质,并将其与共价化合物的光学性质进行对比。由于其固有的自终止表面结构和减少的非辐射复合,BP在室温下的发光和光电探测方面表现出高性能。此外,本综述突出了BP薄膜大面积加工的最新进展,为实际器件应用和集成铺平了道路。最后,我们探讨了在利用BP制造功能性中红外器件方面当前面临的挑战和新出现的机遇。

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