Faust Jessica L, Toth Evan Z, Adams Jason, Erb Randall M
Department of Mechanical and Industrial Engineering, Northeastern University, Boston, Massachusetts 02115, United States.
Raytheon Technologies, Andover, Massachusetts 01810, United States.
ACS Appl Mater Interfaces. 2024 Nov 6;16(44):61061-61070. doi: 10.1021/acsami.4c14039. Epub 2024 Oct 25.
Thermal management is becoming one of the most significant design and size limitations for high power density electronics, including motherboards, power converters, and phased array antennas for 5G communications. There are few options for conducting heat away with dielectric materials that avoid shortening or distorting the performance of these electronics. Certain highly thermally conductive 2D and 3D materials, including hexagonal boron nitride and diamond, offer ideal material properties to address these issues but are extremely challenging to process. This work studies highly oriented single-particle thick films of hexagonal boron nitride, manufactured through a modified Langmuir-Blodgett process and densified further using the Marangoni effect to attain remarkable thermal conductivity enhancement with minimal coating thickness. High loadings of hexagonal boron nitride (∼60 vol %) in dense, castable films are also produced to compare thermal spreading ability in a comparatively simpler but less-coordinated percolated system to the highly percolated particle monolayers. These procedures were applied to glass fiber reinforced polymers used in aerospace and radome applications as well as to a single-board computer to demonstrate enhanced thermal management.
热管理正成为高功率密度电子产品(包括主板、电源转换器和用于5G通信的相控阵天线)最重要的设计和尺寸限制因素之一。利用介电材料散热的选择很少,这些材料要避免缩短或扭曲这些电子产品的性能。某些高导热的二维和三维材料,包括六方氮化硼和金刚石,具有解决这些问题的理想材料特性,但加工极具挑战性。这项工作研究了六方氮化硼的高度取向单颗粒厚膜,通过改进的朗缪尔-布洛杰特工艺制造,并利用马兰戈尼效应进一步致密化,以在最小涂层厚度下实现显著的热导率增强。还制备了致密、可浇铸薄膜中高负载量(约60体积%)的六方氮化硼,以比较在相对简单但协调性较差的渗流系统中与高度渗流颗粒单层的热扩散能力。这些方法应用于航空航天和天线罩应用中使用的玻璃纤维增强聚合物以及单板计算机,以展示增强的热管理。