Suppr超能文献

一种用于超声成像系统的低复杂度高频专用集成电路收发器。

A low-complexity and high-frequency ASIC transceiver for an ultrasound imaging system.

作者信息

Lee Jaeho, Huh Keun Young, Kang Dongil, Lim Jaemyung, Lee Byung Chul, Lee Byunghun

机构信息

Department of Electronic Engineering, Hanyang University, Seoul, 04763 South Korea.

Bionics Research Center, Korea Institute of Science and Technology (KIST), Seoul, 02792 South Korea.

出版信息

Biomed Eng Lett. 2024 Jul 25;14(6):1377-1384. doi: 10.1007/s13534-024-00411-1. eCollection 2024 Nov.

Abstract

This article presents a high-frequency application-specific integrated circuit (ASIC) transceiver for an ultrasound imaging system designed with a focus on low complexity. To simplify the design, it employs a conventional Class-D power amplifier structure for the transmitter (TX) and a resistive feedback transimpedance amplifier (TIA), which consists of a common-source amplifier followed by a source follower for the receiver (RX). Through careful optimization, the RX achieves a measured transimpedance gain of 90 dBΩ and an input-referred noise of 5.6 pA/√Hz at 30 MHz while maintaining a wide bandwidth of up to 30 MHz for both the TX and RX. The power consumption of the TX and RX is measured to be 7.767 mW and 2.5 mW, respectively. Further acoustic performance, assessed using an annular capacitive micromachined ultrasonic transducer (CMUT), showed a 1.78 kPa peak pressure from a 20 V pulser and confirmed the full bandwidth compatibility of the CMUT's bandwidth. The ASIC transceiver has been fabricated using a 0.18 μm HV bipolar-CMOS-DMOS (BCD) process.

摘要

本文介绍了一种用于超声成像系统的高频专用集成电路(ASIC)收发器,其设计重点在于低复杂度。为简化设计,发射器(TX)采用传统的D类功率放大器结构,接收器(RX)采用电阻反馈跨阻放大器(TIA),该跨阻放大器由一个共源放大器和一个源极跟随器组成。通过精心优化,RX在30MHz时实现了90dBΩ的测量跨阻增益和5.6pA/√Hz的输入参考噪声,同时TX和RX都保持高达30MHz的宽带宽。TX和RX的功耗分别测量为7.767mW和2.5mW。使用环形电容式微机械超声换能器(CMUT)评估的进一步声学性能表明,20V脉冲发生器产生的峰值压力为1.78kPa,并证实了CMUT带宽的全带宽兼容性。该ASIC收发器已采用0.18μm高压双极 - 互补金属氧化物半导体 - 双扩散金属氧化物半导体(BCD)工艺制造。

相似文献

7
Highly Integrated Guidewire Ultrasound Imaging System-on-a-Chip.高度集成的导丝超声成像片上系统
IEEE J Solid-State Circuits. 2020 May;55(5):1310-1323. doi: 10.1109/jssc.2020.2967551. Epub 2020 Jan 30.

本文引用的文献

3
A Prototype System With Custom-Designed RX ICs for Contrast-Enhanced Ultrasound Imaging.一种用于超声造影成像的带有定制设计接收集成电路的原型系统。
IEEE Trans Ultrason Ferroelectr Freq Control. 2022 May;69(5):1649-1660. doi: 10.1109/TUFFC.2022.3161226. Epub 2022 Apr 27.
8
Highly Integrated Guidewire Ultrasound Imaging System-on-a-Chip.高度集成的导丝超声成像片上系统
IEEE J Solid-State Circuits. 2020 May;55(5):1310-1323. doi: 10.1109/jssc.2020.2967551. Epub 2020 Jan 30.
9
Flexible Body-Conformal Ultrasound Patches for Image-Guided Neuromodulation.用于图像引导神经调控的柔性体贴合超声贴片。
IEEE Trans Biomed Circuits Syst. 2020 Apr;14(2):305-318. doi: 10.1109/TBCAS.2019.2959439. Epub 2019 Dec 12.
10
Analysis and Design of High-Frequency 1-D CMUT Imaging Arrays in Noncollapsed Mode.高频一维 CMUT 非塌陷模式成像阵列的分析与设计。
IEEE Trans Ultrason Ferroelectr Freq Control. 2019 Feb;66(2):382-393. doi: 10.1109/TUFFC.2018.2887043. Epub 2018 Dec 17.

文献检索

告别复杂PubMed语法,用中文像聊天一样搜索,搜遍4000万医学文献。AI智能推荐,让科研检索更轻松。

立即免费搜索

文件翻译

保留排版,准确专业,支持PDF/Word/PPT等文件格式,支持 12+语言互译。

免费翻译文档

深度研究

AI帮你快速写综述,25分钟生成高质量综述,智能提取关键信息,辅助科研写作。

立即免费体验