Feng Fan, Pu Yanan, Hou Su, Zhu Congrui, Chen Shougang
School of Materials Science and Engineering, Ocean University of China, Qingdao 266100, China.
School of Materials Science and Engineering, Ocean University of China, Qingdao 266100, China; Department of Chemical and Materials Engineering, University of Alberta, Edmonton, AB T6G 1H9, Canada.
Bioelectrochemistry. 2025 Apr;162:108854. doi: 10.1016/j.bioelechem.2024.108854. Epub 2024 Nov 22.
This research examined the varying susceptibility of pure copper (Cu), 90/10 copper-nickel (Cu-Ni) alloy, 70/30 Cu-Ni alloy, and pure nickel (Ni) to microbiologically influenced corrosion (MIC) induced by Desulfovibrio vulgaris, with a focus on the elemental composition of the materials. The results revealed a progressive shift in MIC behavior across these metals and alloys, with increased corrosion severity observed as Ni content decreased. Element Ni improved the corrosion resistance of the alloy while also preventing the growth of microorganisms. Both planktonic and sessile cell counts decreased as the Ni content increased. The corrosion rate, determined by weight loss, followed this order: pure Cu (25.7 ± 3.8 mg·cm, 0.75 mm·y) > 90/10 Cu-Ni alloy (9.1 ± 1.4 mg·cm, 0.27 mm·y) > 70/30 Cu-Ni alloy (4.3 ± 0.8 mg·cm, 0.16 mm·y) > pure Ni (2.1 ± 0.7 mg·cm, 0.06 mm·y). The corrosion current density (i) of pure Cu (3.03 × 10 A·cm) was approximately 20-fold that of pure Ni (1.54 × 10 A·cm). There was a correlation between the electrochemical and weight loss results. Thermodynamic analysis and experimental results indicated that M-MIC was the primary MIC mechanism for pure Cu. While both M-MIC and EET-MIC were engaged in the MIC mechanisms of 90/10 Cu-Ni and 70/30 Cu-Ni alloys, the predominant mechanism was EET-MIC for pure Ni.
本研究考察了纯铜（Cu）、90/10铜镍（Cu-Ni）合金、70/30 Cu-Ni合金和纯镍（Ni）对由普通脱硫弧菌引起的微生物影响腐蚀（MIC）的不同敏感性，重点关注材料的元素组成。结果显示，这些金属和合金的MIC行为呈渐进性变化，随着镍含量降低，腐蚀严重程度增加。镍元素提高了合金的耐腐蚀性，同时还能抑制微生物生长。随着镍含量增加，浮游细胞和固着细胞数量均减少。通过失重法测定的腐蚀速率遵循以下顺序：纯铜（25.7±3.8毫克·厘米，0.75毫米·年）＞90/10 Cu-Ni合金（9.1±1.4毫克·厘米，0.27毫米·年）＞70/30 Cu-Ni合金（4.3±0.8毫克·厘米，0.16毫米·年）＞纯镍（2.1±0.7毫克·厘米，0.06毫米·年）。纯铜的腐蚀电流密度（i）（3.03×10安·厘米）约为纯镍（1.54×10安·厘米）的20倍。电化学结果与失重结果之间存在相关性。热力学分析和实验结果表明，M-MIC是纯铜的主要MIC机制。虽然M-MIC和EET-MIC都参与了90/10 Cu-Ni和70/30 Cu-Ni合金的MIC机制，但纯镍的主要机制是EET-MIC。
