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高强度高镁含量铜镁合金在热镦粗和冷镦粗试验中经历单次50%变形操作后的性能演变

Evolution of Properties of High-Strength and High-Mg-Content CuMg Alloys After Being Subjected to Single Operation 50% Deformation in Hot and Cold Upsetting Tests.

作者信息

Strzępek Paweł, Zasadzińska Małgorzata, Noga Piotr, Skrzekut Tomasz

机构信息

Faculty of Non-Ferrous Metals, AGH University of Krakow, al. Mickiewicza 30, 30-059 Krakow, Poland.

出版信息

Materials (Basel). 2024 Nov 8;17(22):5467. doi: 10.3390/ma17225467.

Abstract

Since most hot and cold metal-forming processes originate from various casting processes, it is important to test their susceptibility to the deformation of new materials. Cast rods of CuMg alloys with a Mg content of 2, 2.4, 2.8, 3, 3.2, 3.6, and 4 wt.% were obtained in the continuous casting process with pure copper as a reference material in order to obtain information on the material's ability to withstand 50% deformation. The materials in the as-cast state were subjected to solutioning, cold drawing, and recrystallization. After each process, samples were taken and subjected to upsetting tests with 50% deformation applied in a single operation. Additionally, materials in the as-cast state were subjected to upsetting tests at 700 °C. The hardness and electrical conductivity of each sample were analyzed. Selected samples were subjected to microstructural analysis. The obtained results show an increase in hardness from 46 HB to 90-126 HB, and a further increase to 150-190 HB with a quasi-linear decrease of electrical conductivity, which proved the influence of solid-solution and strain hardening, respectively. The microstructural analysis proved that such deformation does not cause microcracks. Furthermore, in the case of CuMg up to 3 wt.% of Mg, the alloying additive completely dissolved after solutioning.

摘要

由于大多数热、冷金属成型工艺都源自各种铸造工艺,因此测试它们对新材料变形的敏感性很重要。为了获得材料承受50%变形能力的相关信息,在连续铸造过程中制备了镁含量为2、2.4、2.8、3、3.2、3.6和4 wt.%的CuMg合金铸棒,并以纯铜作为参考材料。对铸态材料进行固溶处理、冷拔和再结晶处理。在每个工艺之后,取样并进行单次施加50%变形的镦粗试验。此外,对铸态材料在700℃下进行镦粗试验。分析了每个样品的硬度和电导率。对选定的样品进行微观结构分析。所得结果表明,硬度从46 HB增加到90 - 126 HB,然后进一步增加到150 - 190 HB,同时电导率呈准线性下降,这分别证明了固溶强化和应变强化的影响。微观结构分析证明,这种变形不会导致微裂纹。此外,对于镁含量高达3 wt.%的CuMg合金,合金添加剂在固溶处理后完全溶解。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/533a/11595621/8978ac20e8b2/materials-17-05467-g001.jpg

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