Effect of Cold Deformation on the Microstructural and Property Uniformity of AlO/Cu Composites.

Copper matrix composites (Cu-MCs) have garnered significant attention due to their exceptional electrical, wear-resistant, and mechanical properties. Among them, AlO/Cu composites, reinforced with AlO, are a focal point in the field of high-strength, high-conductivity copper alloys, owing to their high strength, excellent electrical conductivity, and superior resistance to high-temperature softening. Cold deformation is an effective method for enhancing the mechanical properties of AlO/Cu composites. However, during cold deformation of large-cross-sectional AlO/Cu composites, the inhomogeneity in microstructure and properties induced by varying stress states cannot be overlooked. In this study, cold deformation of 1.12 wt% AlO/Cu large-cross-sectional composites was performed using a rolling process, coupled with finite element numerical simulations, to investigate the distribution characteristics of microstructure and properties during the rolling process. The results indicate that under cold deformation, the hardness of the material increases linearly from the surface layer to the core, while the change in electrical conductivity is minimal. The increase in hardness is closely related to variations in dislocation density and grain size, with dislocation density being the dominant strengthening mechanism. Quantitative analysis reveals that strain inhomogeneity during cold deformation is the primary cause of microstructural differences, leading to variations in mechanical properties at different positions. This study provides a theoretical basis for understanding the inhomogeneity of cold deformation in large-sized AlO/Cu composites and for controlling their microstructure-property relationships.