Li Zhenhai, Tang Shuqi, Wang Tianyu, Liu Yongkai, Meng Jialin, Yu Jiajie, Xu Kangli, Yuan Ruihong, Zhu Hao, Sun Qingqing, Chen Shiyou, Zhang David Wei, Chen Lin
School of Microelectronics, Fudan University, State Key Laboratory of Integrated Chips and Systems, Shanghai, 200433, P. R. China.
School of Integrated Circuits, Anhui University, Hefei, 230601, P. R. China.
Adv Sci (Weinh). 2025 Jan;12(4):e2410765. doi: 10.1002/advs.202410765. Epub 2024 Dec 4.
Hafnium oxide (HfO)-based devices have been extensively evaluated for high-speed and low-power memory applications. Here, the influence of aluminum (Al) and lanthanum (La) co-doping HfO thin films on the ferroelectric characteristics of hafnium-based devices is investigated. Among devices with different La/Al ratios, the Al and La co-doped hafnium oxide (HfAlAO) device with 4.2% Al and 2.17% La exhibited the excellent remanent polarization and thermostability. Meanwhile, first principal analyses verified that hafnium-based thin films with 4.2% Al and 2.17% La promoted the formation of the o-phase against the paraelectric phase, providing theoretical support for supporting experimental results. Furthermore, a vertical ferroelectric HfO memory based on 3D macaroni architecture is reported. The devices show excellent ferroelectric characteristics of 22 µC cm under 4.5 MV cm and minimal coercive field of ≈1.6 V. In addition, the devices exhibit great memory performance, including the response speed of device can achieve 20 ns and endurance characteristic can achieve 10 cycles.
基于氧化铪(HfO)的器件已针对高速和低功耗存储应用进行了广泛评估。在此,研究了铝(Al)和镧(La)共掺杂HfO薄膜对基于铪的器件铁电特性的影响。在具有不同La/Al比率的器件中,含有4.2% Al和2.17% La的Al和La共掺杂氧化铪(HfAlAO)器件表现出优异的剩余极化和热稳定性。同时,第一性原理分析证实,含有4.2% Al和2.17% La的基于铪的薄膜促进了相对于顺电相的o相形成,为支持实验结果提供了理论支持。此外,还报道了一种基于3D通心粉结构的垂直铁电HfO存储器。这些器件在4.5 MV/cm下表现出22 μC/cm的优异铁电特性,以及约1.6 V的最小矫顽场。此外,这些器件还表现出出色的存储性能,包括器件的响应速度可达到20 ns,耐久性特性可达到10次循环。