School of Microelectronics, Fudan University, Shanghai 200433, P. R. China.
Zhangjiang Fudan International Innovation Center, Shanghai 201203, P. R. China.
Nano Lett. 2023 May 24;23(10):4675-4682. doi: 10.1021/acs.nanolett.3c00085. Epub 2023 Mar 13.
Hafnium oxide (HfO)-based ferroelectric tunnel junctions (FTJs) have been extensively evaluated for high-speed and low-power memory applications. Herein, we investigated the influence of Al content in HfAlO thin films on the ferroelectric characteristics of HfAlO-based FTJs. Among HfAlO devices with different Hf/Al ratios (20:1, 34:1, and 50:1), the HfAlO device with Hf/Al ratio of 34:1 exhibited the highest remanent polarization and excellent memory characteristics and, thereby, the best ferroelectricity among the investigated devices. Furthermore, first-principal analyses verified that HfAlO thin films with Hf/Al ratio of 34:1 promoted the formation of the orthorhombic phase against the paraelectric phase as well as alumina impurities and, thus, enhanced the ferroelectricity of the device, providing theoretical support for supporting experimental results. The findings of this study provide insights for developing HfAlO-based FTJs for next-generation in-memory computing applications.
基于氧化铪(HfO)的铁电隧道结(FTJ)已被广泛评估用于高速和低功耗存储应用。在此,我们研究了 HfAlO 薄膜中 Al 含量对 HfAlO 基 FTJ 铁电特性的影响。在具有不同 Hf/Al 比(20:1、34:1 和 50:1)的 HfAlO 器件中,Hf/Al 比为 34:1 的 HfAlO 器件表现出最高的剩余极化和优异的存储特性,因此在研究的器件中具有最佳的铁电性。此外,第一性原理分析证实,Hf/Al 比为 34:1 的 HfAlO 薄膜有利于形成正交相而不是顺电相以及氧化铝杂质,从而增强了器件的铁电性,为支持实验结果提供了理论依据。本研究的结果为开发用于下一代内存计算应用的 HfAlO 基 FTJ 提供了思路。