Cruz-Cruz Isidro, Hernández-Maya Roberto, Reséndiz-Hernández José Emiliano, Olvera-Trejo Daniel, Martínez-Romero Oscar, Ulloa Castillo Nicolas A, Elías-Zúñiga Alex
Tecnologico de Monterrey, Institute of Advanced Materials for Sustainable Manufacturing, Ave. Eugenio Garza Sada 2501 Sur, Col. Tecnológico, Monterrey, 64700, N.L., Mexico.
Siemens, Research and Development Department, Libramiento Arco Vial Poniente Km 4.2, Santa Catarina, 66350, Nuevo León, Mexico.
Heliyon. 2024 Oct 30;10(22):e39965. doi: 10.1016/j.heliyon.2024.e39965. eCollection 2024 Nov 30.
Novel copper-nickel matrix composites reinforced with silicon carbide (SiC) micro particles for metal contact applications were manufactured by powder metallurgy technology and were experimentally characterized. Cu and Cu alloys are commonly used as metal contact for either vacuum, oil, or SF6 in low-voltage circuit breaker devices, but their application in environments with the presence of oxygen is limited due to their tendency to form high-resistance copper oxides. Thus, the addition of Ni as an alloying element provides resistance to both humidity and several corrosive environments and increases the composites' hardness, mechanical strength, and wear resistance. Moreover, SiC was chosen due to its contribution to mechanical strength, mouldability, low production cost, and non-reactive nature at ordinary temperatures. Here, three SiC particle size distributions were considered, and it was found that the composites' physical properties are also dependent on the ceramic loading. After evaluating these properties, two specific SiC concentrations were potentially considered for electrode applications: 10 wt% and 20 wt%. The obtained hardness values are in the range of 55-65 HR30T which guarantees the necessary strength without detriment of the contact area whereas the welding is minimized. In addition to a homogeneous particle distribution in the solid material, specific wear resistance of ∼10 mmNm and electrical conductivities of ∼20 %IACS were obtained. Considering these parameters, Cu-Ni/SiC composites' performance is not compromised compared to commercial Ag/WC materials commonly used in metal contact applications.
采用粉末冶金技术制备了用于金属接触应用的新型碳化硅(SiC)微粒增强铜镍基复合材料,并对其进行了实验表征。铜和铜合金通常用作低压断路器装置中真空、油或六氟化硫环境下的金属触头,但由于它们易于形成高电阻的氧化铜,因此在有氧环境中的应用受到限制。因此,添加镍作为合金元素可提高复合材料对湿度和多种腐蚀环境的耐受性,并提高其硬度、机械强度和耐磨性。此外,选择SiC是因为它有助于提高机械强度、可模塑性、降低生产成本,并且在常温下具有惰性。这里考虑了三种SiC粒度分布,发现复合材料的物理性能也取决于陶瓷负载量。在评估这些性能后,电极应用可能会考虑两种特定的SiC浓度:10 wt%和20 wt%。获得的硬度值在55-65 HR30T范围内,这保证了必要的强度,同时不会损害接触面积,并且将焊接减到最小。除了在固体材料中具有均匀的颗粒分布外,还获得了约10 mmNm的比耐磨性和约20 %IACS的电导率。考虑到这些参数,与金属接触应用中常用的商用Ag/WC材料相比,Cu-Ni/SiC复合材料的性能并未受到影响。