Alawadhi Meshal Y, Aloraier Abdulkareem S, Alaskari Ayman M, Alazemi Abdullah A, Huang Yi
Department of Manufacturing Engineering Technology, The Public Authority for Applied Education and Training (PAAET), College of Technological Studies, Shuwaikh 70654, Kuwait.
Mechanical Engineering Department, College of Engineering Petroleum, Kuwait University, P.O. Box 5969, Safat 13060, Kuwait.
Materials (Basel). 2024 Dec 1;17(23):5886. doi: 10.3390/ma17235886.
This study explores the impact of short-term annealing on the thermal stability and mechanical properties of oxygen-free copper subjected to high-pressure torsion (HPT). Copper samples were deformed through HPT with varying numbers of turns at room temperature and subsequently subjected to short-term annealing at temperatures of 398 K and 423 K. Microstructural analysis revealed that annealing led to grain growth and a reduction in dislocation density, with samples processed with fewer HPT turns exhibiting more significant grain coarsening. The microhardness measurements indicated a reduction in hardness after annealing, particularly at the edges of the discs, suggesting recrystallization. Samples processed with 10 HPT turns demonstrated higher thermal stability and less grain growth compared to 1/2-turn samples. The findings suggest that post-HPT short-term annealing can be used to tailor the balance between strength and ductility in oxygen-free copper, enhancing its suitability for industrial applications.
本研究探讨了短期退火对经过高压扭转（HPT）处理的无氧铜的热稳定性和力学性能的影响。铜样品在室温下通过不同圈数的HPT进行变形，随后在398 K和423 K的温度下进行短期退火。微观结构分析表明，退火导致晶粒长大和位错密度降低，HPT圈数较少的样品表现出更显著的晶粒粗化。显微硬度测量表明，退火后硬度降低，特别是在圆盘边缘，这表明发生了再结晶。与1/2圈样品相比，经过10圈HPT处理的样品表现出更高的热稳定性和更少的晶粒长大。研究结果表明，HPT后的短期退火可用于调整无氧铜强度和延展性之间的平衡，提高其在工业应用中的适用性。
