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通过直接墨水书写制备纳米铜高导电性和柔性印刷电子产品

Fabrication of Nano Copper Highly Conductive and Flexible Printed Electronics by Direct Ink Writing.

作者信息

Zhang Peng, Sun Qinghua, Fang Shiyao, Guo Hui, Liu Kang, Zhang Linfu, Zhu Qiang, Wang Min

机构信息

School of Materials Science and Engineering, Harbin Institute of Technology at Weihai, Weihai 264209, China.

Comprehensive Research Center of Electronic Information Technology in the MIIT, Weihai 264209, China.

出版信息

ACS Appl Mater Interfaces. 2025 Jan 8;17(1):1847-1860. doi: 10.1021/acsami.4c14225. Epub 2024 Dec 26.

DOI:10.1021/acsami.4c14225
PMID:39723928
Abstract

Nanoscale metals have emerged as crucial materials for conductive inks in printed electronics due to their unique physical and chemical properties. However, the synthesis of high-precision and highly conductive copper ink remains a challenge. Herein, a high-precision, highly conductive, and oxidation-resistant nanocopper ink was synthesized to fabricate highly conductive and flexible printed electronic devices. Copper nanoparticles with a particle size of only 8.5 nm, a controllable structure, and excellent oxidation resistance were synthesized by the alcohol phase reduction method. The conductive ink was formulated with ethylene glycol, ethanol, and isopropanolamine (IPA) as the solvent, exhibiting excellent printability and sintering reducibility. Fluid dynamics simulations were employed to investigate the influence of printing parameters on the circuit forming performance, enabling precise control over the printing process. The sintering behavior of copper nanoparticles with varying particle sizes was investigated by combining experiments with molecular dynamics (MD) simulations. Highly conductive and flexible circuits were fabricated using direct ink writing (DIW) under low-temperature sintering, exhibiting a low resistance level as low as 1.9 μΩ·cm. Moreover, the circuit demonstrated an excellent adhesion performance and bending flexibility. The developed copper ink demonstrates outstanding printing potential for applications in flexible electronics, advancing the field of flexible printing and wearable electronic devices.

摘要

由于其独特的物理和化学性质,纳米级金属已成为印刷电子中导电油墨的关键材料。然而,高精度和高导电性铜油墨的合成仍然是一个挑战。在此,合成了一种高精度、高导电性和抗氧化的纳米铜油墨,用于制造高导电性和柔性印刷电子器件。通过醇相还原法合成了粒径仅为8.5 nm、结构可控且具有优异抗氧化性的铜纳米颗粒。以乙二醇、乙醇和异丙醇胺(IPA)为溶剂配制导电油墨,表现出优异的可印刷性和烧结还原性。采用流体动力学模拟研究印刷参数对电路形成性能的影响,从而实现对印刷过程的精确控制。通过实验与分子动力学(MD)模拟相结合的方法,研究了不同粒径铜纳米颗粒的烧结行为。在低温烧结条件下,采用直接墨水书写(DIW)制备了高导电性和柔性电路,其电阻低至1.9 μΩ·cm。此外,该电路还表现出优异的附着力和弯曲柔韧性。所开发的铜油墨在柔性电子领域具有出色的印刷潜力,推动了柔性印刷和可穿戴电子设备领域的发展。

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