Hsieh Chi-Yung, Lin Yu-Chi, Huang Xuan-Shan, Lin Jing-Ting, Huang Cheng-Sheng
Department of Mechanical Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.
Micromachines (Basel). 2024 Nov 23;15(12):1412. doi: 10.3390/mi15121412.
This study introduces a novel deposition technique capable of depositing thin films with any arbitrary thickness profile. The apparatus consists of a fixed shadow mask and a rotating sample carrier plate. The shadow mask features a specifically designed opening curve that corresponds to the particular thickness profile of the deposited film. We successfully designed two shadow masks and used them to deposit films with linear thickness gradients of 49.3 and 86.8 Å/mm and films with sinusoidal thickness profiles with a period of 40 mm. Furthermore, a linear variable filter was designed on the basis of a quarter-wavelength stack of SiN and SiO, combined with a TiO cavity layer with a linearly varying thickness. By coaxially rotating the sample carrier plate relative to the shadow mask, films with the desired thickness profiles could be fabricated in a single deposition step without the need for additional rotational or translational devices inside the deposition chamber. By rotating the carrier plate, the chips attached at different circumferential positions can achieve consistent thickness profiles, making this method well-suited for mass production.
本研究介绍了一种新型沉积技术,该技术能够沉积具有任意厚度分布的薄膜。该装置由一个固定的荫罩和一个旋转的样品载板组成。荫罩具有专门设计的开口曲线,该曲线与沉积薄膜的特定厚度分布相对应。我们成功设计了两个荫罩,并使用它们沉积了线性厚度梯度分别为49.3 Å/mm和86.8 Å/mm的薄膜以及周期为40 mm的正弦厚度分布薄膜。此外,基于SiN和SiO的四分之一波长堆叠,并结合厚度线性变化的TiO腔层,设计了一种线性可变滤光片。通过使样品载板相对于荫罩同轴旋转,可以在单个沉积步骤中制造出具有所需厚度分布的薄膜,而无需在沉积室内使用额外的旋转或平移装置。通过旋转载板,附着在不同圆周位置的芯片可以实现一致的厚度分布,使得该方法非常适合大规模生产。