Sánchez Vergara María Elena, Rocha Flores José Miguel, Cantera-Cantera Luis Alberto, Ballinas-Indilí Ricardo, Flores Huerta Alejandro, Álvarez-Toledano Cecilio
Faculty of Engineering, Universidad Anáhuac México, Av. Universidad Anáhuac 46, Col. Lomas Anáhuac, Huixquilucan 52786, Mexico.
Polytechnic University of Cuautitlán Izcalli, Av. Lago de Guadalupe, Colonia Lomas de San Francisco Tepojaco, Cuautitlán Izcalli 54720, Mexico.
Materials (Basel). 2024 Dec 26;18(1):45. doi: 10.3390/ma18010045.
In this work, we present the green synthesis of complex - derived from β-hidroxymethylidene indanones by ultrasound, which allowed for the obtaining of compounds in a shorter time and with good yields. These organotin complexes were then doped with cobalt porphine and incorporated into a poly(3,4-ethylenedioxythiophene):poly(4-styrenesulfonate) matrix to manufacture composite semiconductor films. The semiconductor films were characterized through atomic force microscopy, examining their topography, Knoop hardness (around 17 HK), and tensile strength, which varied from 5 × 10 to 7 × 10 Pa. The optical behavior was evaluated, revealing that the changes in these characteristics are related to the type of organotin complex present in the composite film: the transmittance ranged from 77% to 86%, while the reflectance varied from 13% to 17%. The band gap, calculated using the Kubelka-Munk function F(KM), was approximately 3.7 ± 0.19 eV for all the semiconductor films. Finally, we assessed the electrical behavior of the composite films through current-voltage (I-V) measurements under different lighting conditions. The I-V curves demonstrated that they share a saturation current density of 3.46 mA/mm. However, they differ in their conduction rates within the ohmic regimen. These composite films' optical and electrical properties suggest their potential use in developing electronic devices like organic diodes.
在这项工作中,我们展示了通过超声由β-羟基亚甲基茚满酮合成配合物的绿色方法,该方法能够在更短的时间内以良好的产率获得化合物。然后将这些有机锡配合物用钴卟啉掺杂,并掺入聚(3,4-亚乙基二氧噻吩):聚(4-苯乙烯磺酸盐)基质中以制造复合半导体薄膜。通过原子力显微镜对半导体薄膜进行表征,检测其形貌、努氏硬度(约17 HK)和拉伸强度,拉伸强度在5×10至7×10 Pa之间变化。对光学行为进行了评估,结果表明这些特性的变化与复合薄膜中存在的有机锡配合物类型有关:透过率在77%至86%之间,而反射率在13%至17%之间变化。使用库贝尔卡-蒙克函数F(KM)计算得出,所有半导体薄膜的带隙约为3.7±0.19 eV。最后,我们通过在不同光照条件下的电流-电压(I-V)测量评估了复合薄膜的电学行为。I-V曲线表明它们的饱和电流密度为3.46 mA/mm。然而,它们在欧姆区域内的传导速率不同。这些复合薄膜的光学和电学性质表明它们在开发诸如有机二极管等电子器件方面具有潜在用途。