Wang Wei, Tao Jun, Tong Kaiwen, Xu Zhiqiang, Zhong Fuqi, Dong Jianping, Chen Yanxia, Fu Zhengbing, Qin Caiqin
Jiangxi XinboRui Technology Co., Yingtan 335000, China.
School of Chemistry and Materials Science, Hubei Engineering University, Xiaogan 432000, China.
Molecules. 2025 Jan 8;30(2):229. doi: 10.3390/molecules30020229.
Ultrathin electrolytic copper foils with a thickness of 6 μm were prepared by a test machine using copper sulfate electrolyte with gelatin, hydroxyethyl cellulose (HEC), and sulfonic acid-containing organics as additives. The effects of four sulfonic acid-containing organic additives, sodium 3-mercaptopropanesulfonate (MPS), bis-(sodium sulfopropyl)-disulfide (SPS), sodium 3-[[(dimethylamino)thioxomethyl]thio]propanesulfonate (DPS), and sodium 3-((4,5-dihydrothiazol-2-yl)thio)propane-1-sulfonate (TPS), on the physical property of copper foils were investigated. The results show that all these additives can effectively improve the gloss and tensile strength of electrolytic copper foil, and the texture coefficients of Cu(111) selectivity increase. The synergistic use of HEC and TPS can effectively reduce the pinholes of copper foil.
采用一台试验机，以硫酸铜电解液并添加明胶、羟乙基纤维素（HEC）和含磺酸有机物作为添加剂，制备了厚度为6μm的超薄电解铜箔。研究了四种含磺酸有机添加剂，即3-巯基丙磺酸钠（MPS）、双（磺丙基）二硫化物（SPS）、3-[[（二甲氨基）硫代甲基]硫代]丙磺酸钠（DPS）和3-（（4,5-二氢噻唑-2-基）硫代）丙烷-1-磺酸钠（TPS）对铜箔物理性能的影响。结果表明，所有这些添加剂均可有效提高电解铜箔的光泽度和拉伸强度，且Cu(111)择优取向的织构系数增加。HEC与TPS协同使用可有效减少铜箔的针孔。
