Huang Jian, Song Ning, Chen Mingwei, Tang Yunzhi, Fan Xiaowei
Jiangxi Province Key Laboratory of Functional Crystalline Materials Chemistry, School of Chemistry and Chemical Engineering, Jiangxi University of Science and Technology Ganzhou 341000 China
RSC Adv. 2024 Dec 3;14(51):38268-38278. doi: 10.1039/d4ra06688j. eCollection 2024 Nov 25.
Electroplating additives play a key role in enhancing the physical and chemical performances of electrodeposited copper foils. Currently, a lot of research on polyethylene glycol (PEG) additives has been reported on the metallisation interconnections for printed circuit boards (PCBs); however, research on its applications for electrodeposited copper foils is rarely documented. Herein, high-quality copper foils with high tensile strength (433.2 MPa) and low surface roughness (Rz = 1.7 μm) were electrodeposited on titanium substrates with 4 mg L PEG. The characterization results showed that the copper foil possesses a high (220) crystal plane orientation and low twin layer thickness. Further analysis suggested that twin boundaries strengthened by stacking faults were the main reason for the high tensile strength of copper foils. Electrochemical behavioral studies indicated that PEG increased the cathodic polarization and improved the nucleation rate, thereby refining the copper foil grain size. The high (220) crystal plane orientation and high density of twin grain boundaries caused by the stacking faults strengthened the copper foil more than the fine-grain strengthening. This work offers theoretical guidance for modulating the properties of copper foil using PEG.
电镀添加剂在提高电沉积铜箔的物理和化学性能方面起着关键作用。目前，关于聚乙二醇（PEG）添加剂在印刷电路板（PCB）金属化互连方面已有大量研究报道；然而，其在电沉积铜箔应用方面的研究却鲜有文献记载。在此，在含4 mg/L PEG的钛基底上电沉积出了具有高拉伸强度（433.2 MPa）和低表面粗糙度（Rz = 1.7 μm）的高质量铜箔。表征结果表明，该铜箔具有高（220）晶面取向和低孪晶层厚度。进一步分析表明，由堆垛层错强化的孪晶界是铜箔具有高拉伸强度的主要原因。电化学行为研究表明，PEG增加了阴极极化并提高了形核速率，从而细化了铜箔晶粒尺寸。由堆垛层错导致的高（220）晶面取向和高密度孪晶晶界对铜箔的强化作用超过了细晶强化。这项工作为使用PEG调控铜箔性能提供了理论指导。
