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重组抗体通过多种机制抑制E3泛素连接酶CHIP的酶活性。

Recombinant antibodies inhibit enzymatic activity of the E3 ubiquitin ligase CHIP via multiple mechanisms.

作者信息

Chung Dong Hee, Connelly Emily J, Unnikrishnan Aparna, Chuo Shih-Wei, Wucherer Kristin, Nadel Cory M, Gestwicki Jason E, Southworth Daniel R, Craik Charles S

机构信息

Department of Pharmaceutical Chemistry, University of California, San Francisco, San Francisco, California, USA.

Department of Cellular and Molecular Pharmacology, University of California, San Francisco, San Francisco, California, USA.

出版信息

J Biol Chem. 2025 Mar;301(3):108220. doi: 10.1016/j.jbc.2025.108220. Epub 2025 Jan 23.

Abstract

Carboxyl-terminus of Hsp70-Interacting Protein (CHIP) is an E3 ubiquitin ligase that marks misfolded substrates for degradation. Hyper-activation of CHIP has been implicated in multiple diseases, including cystic fibrosis and cancer, suggesting that it may be a potential drug target. However, there are few tools available for exploring this possibility. Moreover, the best ways of inhibiting CHIP's function are not obvious, as this complex protein is composed of a tetratricopeptide repeat (TPR) domain, a U-box domain, and a coiled-coil domain that mediates homodimerization. To probe the structure and function of CHIP, we report an antibody panning campaign that yielded six recombinant Fabs with affinity for CHIP. Interestingly, these antibodies varied in their binding site(s) and impact on CHIP function, such as inhibiting TPR interactions, autoubiquitination, and/or substrate ubiquitination. Of particular interest, antibody 2F1 nearly eliminated substrate binding (IC = 2.7 μM) and limited ubiquitination and autoubiquitination. Cryo-electron microscopy of the 2F1:CHIP complex revealed a 2:1 binding mode (Fab:CHIP dimer), with 2F1 bound to the U-box domain and simultaneously displacing the TPR domain. Together, these studies provide insight into ways of inhibiting CHIP's activity and provide a series of new probes for exploring the function of this important E3 ubiquitin ligase.

摘要

热休克蛋白70相互作用蛋白(CHIP)的羧基末端是一种E3泛素连接酶,它标记错误折叠的底物以便降解。CHIP的过度激活与多种疾病有关,包括囊性纤维化和癌症,这表明它可能是一个潜在的药物靶点。然而,用于探索这种可能性的工具很少。此外,抑制CHIP功能的最佳方法并不明显,因为这种复杂的蛋白质由一个四肽重复(TPR)结构域、一个U盒结构域和一个介导同源二聚化的卷曲螺旋结构域组成。为了探究CHIP的结构和功能,我们报告了一项抗体淘选活动,该活动产生了六种对CHIP具有亲和力的重组Fab片段。有趣的是,这些抗体在其结合位点以及对CHIP功能的影响方面存在差异,例如抑制TPR相互作用、自身泛素化和/或底物泛素化。特别值得关注的是,抗体2F1几乎消除了底物结合(IC = 2.7 μM),并限制了泛素化和自身泛素化。2F1:CHIP复合物的冷冻电子显微镜显示出2:1的结合模式(Fab:CHIP二聚体),其中2F1与U盒结构域结合并同时取代TPR结构域。总之,这些研究为抑制CHIP活性的方法提供了见解,并为探索这种重要的E3泛素连接酶的功能提供了一系列新的探针。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/adbf/11883360/14e529117bca/gr1.jpg

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