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通过元素掺杂改善BiSbTeSe的电输运性能。

Improvement of Electrical Transport Performance of BiSbTeSe by Elemental Doping.

作者信息

Zhu Peng, Zhang Xin, Yang Liu, Zhang Yuqi, Hu Deng, Chen Fuhong, Qi Haoyu, Wang Zhiwei

机构信息

Centre for Quantum Physics, Key Laboratory of Advanced Optoelectronic Quantum Architecture and Measurement (MOE), School of Physics, Beijing Institute of Technology, Beijing 100081, China.

Beijing Key Lab of Nanophotonics and Ultrafine Optoelectronic Systems, Beijing Institute of Technology, Beijing 100081, China.

出版信息

Materials (Basel). 2025 Feb 28;18(5):1110. doi: 10.3390/ma18051110.

Abstract

A topological insulator with large bulk-insulating behavior and high electron mobility of the surface state is needed urgently, not only because it would be a good platform for studying topological surface states but also because it is a prerequisite for potential future applications. In this work, we demonstrated that tin (Sn) or indium (In) dopants could be introduced into a BiSbTeSe single crystal. The impacts of the dopants on the bulk-insulating property and electron mobility of the surface state were systematically investigated by electrical transport measurements. The doped single crystals had the same crystal structure as the pristine BiSbTeSe, no impure phase was observed, and all elements were distributed homogeneously. The electrical transport measurements illustrated that slight Sn doping could improve the performance of BiSbTeSe a lot, as the longitudinal resistivity (), bulk carrier density (), and electron mobility of the surface state () reached about 11 Ωcm, 7.40 × 10 cm, and 6930 cm/(Vs), respectively. By comparison, indium doping could also improve the performance of BiSbTeSe with , , and up to about 13 Ωcm, 1.29 × 10 cm, and 4500 cm/(Vs), respectively. Our findings suggest that Sn- or indium-doped BiSbTeSe crystals should be good platforms for studying novel topological properties, as well as promising candidates for low-dissipation electron transport, spin electronics, and quantum computing.

摘要

迫切需要一种具有大的体绝缘行为和高表面态电子迁移率的拓扑绝缘体,这不仅是因为它将是研究拓扑表面态的良好平台,还因为它是未来潜在应用的先决条件。在这项工作中,我们证明了可以将锡(Sn)或铟(In)掺杂剂引入BiSbTeSe单晶中。通过电输运测量系统地研究了掺杂剂对体绝缘性能和表面态电子迁移率的影响。掺杂后的单晶与原始BiSbTeSe具有相同的晶体结构,未观察到杂质相,且所有元素分布均匀。电输运测量表明,轻微的Sn掺杂可以显著提高BiSbTeSe的性能,其纵向电阻率()、体载流子密度()和表面态电子迁移率()分别达到约11Ωcm、7.40×10cm和6930cm/(Vs)。相比之下,铟掺杂也可以提高BiSbTeSe的性能,其、和分别高达约13Ωcm、1.29×10cm和4500cm/(Vs)。我们的研究结果表明,Sn或铟掺杂的BiSbTeSe晶体应该是研究新型拓扑性质的良好平台,也是低耗散电子输运、自旋电子学和量子计算的有前途的候选材料。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e17e/11901429/55943a381a7a/materials-18-01110-g001.jpg

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