Choi Halim, Illés Balázs, Dušek Karel
Department of Electronics Technology, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, 1111 Budapest, Hungary.
LTCC Research Group, Łukasiewicz Research Network, Institute of Microelectronics and Photonics, 30701 Kraków, Poland.
Materials (Basel). 2025 Mar 2;18(5):1130. doi: 10.3390/ma18051130.
Soldering with Sn alloys has always been the essential assembly step of microelectronics. The conductive Sn whiskers, which can spontaneously grow from soldering surfaces, mean a considerable reliability risk for microelectronics due to possible short circuit formation between the leads of the components. Since their discovery in 1951, thousands of research studies have been conducted to unravel their growth mechanisms and find effective prevention methods against them. Till 2006, the Sn whisker problem was solved and partially forgotten due to the very effective whisker suppression effect of Pb alloying into the solder materials. The lead-free change gave new impetus to the problem, which was further enhanced by the application of new material systems, growing reliability requirements, and accelerating miniaturization in the 21st century. Our review would like to give an overview of the Sn whisker's history from the beginning till the latest results, focusing on the suppression solutions by the modification of the solder alloy compositions. Recently, promising results have been reached by alloying Bi and In, which are metals that are the focus of low-temperature soldering, and by composite solders.
使用锡合金进行焊接一直是微电子学的关键组装步骤。导电锡须能够从焊接表面自发生长，由于其可能在元件引脚之间形成短路，这对微电子学来说意味着相当大的可靠性风险。自1951年被发现以来，已经开展了数千项研究，以揭示其生长机制并找到有效的预防方法。到2006年，由于铅合金化到焊料材料中具有非常有效的抑制晶须效果，锡须问题得到了解决并在一定程度上被遗忘。无铅变革给这个问题带来了新的推动力，在21世纪，新材料系统的应用、不断提高的可靠性要求以及加速的小型化进一步加剧了这一问题。我们的综述旨在概述锡须从起源到最新研究成果的历史，重点关注通过改变焊料合金成分的抑制解决方案。最近，通过将低温焊接的重点金属铋和铟合金化以及采用复合焊料，已经取得了有前景的成果。
