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咖啡银皮作为胶合板的可持续替代填料:表征与性能分析

Coffee Silverskin as a Sustainable Alternative Filler for Plywood: Characterization and Performance Analysis.

作者信息

Wronka Anita, Del Valle Raydan Nidal, Robles Eduardo, Kowaluk Grzegorz

机构信息

Institute of Wood Sciences and Furniture, Warsaw University of Life Sciences-SGGW, Nowoursynowska St. 159, 02-776 Warsaw, Poland.

CNRS, Institute of Analytical and Physicochemical Sciences for the Environment and Materials (IPREM-UMR 5254), University of Pau and the Adour Region, 403 Rue Saint Pierre, 40004 Mont de Marsan, France.

出版信息

Materials (Basel). 2025 Mar 28;18(7):1525. doi: 10.3390/ma18071525.

Abstract

Coffee silverskin, a by-product of coffee processing, was studied using microscopic (SEM), spectroscopic (FTIR), and thermogravimetric (TGA, DSC) methods to assess its use as a substitute filler in the manufacturing of plywood. TGA showed that the material was compatible with plywood hot pressing temperatures (140 °C) and that it was thermally stable up to 50 °C, with a notable decomposition event at 335 °C. Functional groups like hydroxyl and carbonyl were detected by FTIR analysis, indicating possible hydrogen bonds and chemical adaptability. DSC analysis confirmed structural alterations by highlighting endothermic processes associated with dehydration and an exothermic transition over 150 °C. Coffee silverskin substituted rye flour in plywood adhesive compositions at different concentrations (0%, 1%, 5%, 10%, and 20%). Due to the structural and chemical constraints of the filler, larger concentrations (10% and 20%) dramatically lowered bonding strength, whereas low silverskin amounts (1% and 5%) attained strengths equivalent to rye flour, reaching up to 5 N mm, according to internal bond strength tests. SEM images revealed smaller, more fragmented, and porous silverskin particles than larger, compact rye flour particles, which affected mechanical interlocking and adhesion. The findings point to coffee silverskin as an environmentally friendly and performance-balancing substitute for conventional fillers, especially at medium levels.

摘要

咖啡银皮是咖啡加工的副产品,采用显微镜(扫描电子显微镜)、光谱(傅里叶变换红外光谱)和热重分析(热重分析仪、差示扫描量热仪)方法进行研究,以评估其在胶合板制造中作为替代填料的用途。热重分析表明,该材料与胶合板热压温度(140°C)兼容,在高达50°C的温度下具有热稳定性,在335°C时发生显著分解。傅里叶变换红外光谱分析检测到羟基和羰基等官能团,表明可能存在氢键和化学适应性。差示扫描量热分析通过突出与脱水相关的吸热过程和超过150°C的放热转变,证实了结构变化。咖啡银皮在胶合板胶粘剂组合物中以不同浓度(0%、1%、5%、10%和20%)替代黑麦粉。根据内结合强度测试,由于填料的结构和化学限制,较高浓度(10%和20%)会显著降低粘结强度,而低银皮含量(1%和5%)可达到与黑麦粉相当的强度,高达5 N/mm。扫描电子显微镜图像显示,银皮颗粒比大的、致密的黑麦粉颗粒更小、更破碎且多孔,这影响了机械联锁和粘附。研究结果表明,咖啡银皮是一种环保且性能平衡的传统填料替代品,尤其是在中等含量时。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/15fe/11989794/782fbb2d550d/materials-18-01525-g001.jpg

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