Liu Bingxiao, Zhu Yunzhen, Yang Chen, Ma Liqun, Zhang Fuchun, Hao Mingzheng, Wang Zhongqiang, Bai Lizhen, An Jiale, Xiao Dongqi
Department of Materials Engineering, Taiyuan Institute of Technology, Taiyuan 030008, China.
Shanxi Center of Technology Innovation for Polyamide Materials, Taiyuan 030000, China.
Polymers (Basel). 2025 Apr 10;17(8):1031. doi: 10.3390/polym17081031.
In this paper, we report a novel thermally conductive semi-aromatic heat-resistant PA5T-CO-10T/hexagonal boron nitride (PA5T-CO-10T/BN) composite, based on as-synthesized PA5T-CO-10T, which is a copolymer of poly (pentamethylene terephthalamide) (PA5T) and poly (decamethylene terephthalamide) (PA10T). We confirmed the structure of PA5T-CO-10T through a nuclear magnetic resonance carbon spectrometer (C-NMR). The differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) results indicate that PA5T-CO-10T demonstrates a processing window (greater than 90 °C) which is suitable for melt processing and injection molding. Moreover, the PA5T-CO-10T composites with different BN contents were tested by scanning electron microscopy (SEM), a thermal conductivity meter, a rotational rheometer and X-ray diffraction (XRD). The results indicate that as the content of h-BN increases, the thermal conductivity of the PA5T-CO-10T/BN composites is significantly enhanced. When the mass of h-BN reaches 30 wt%, the thermal conductivity of the composite material is 2.5 times that of the original matrix resin. Simultaneously, there is a notable upward trend observed in the storage modulus, loss modulus, complex viscosity and orientation degree of h-BN. This is attributed to the high thermal conductivity and the high orientation degree of h-BN, which ensure the continuous enhancement of the material's thermal conductivity. Additionally, the introduction of h-BN enhances the degree of connection between the material's molecular chains. PA5T-CO-10T/BN possesses excellent heat resistance and thermal conductivity, presenting significant application prospects in the fields of electronics, electrical appliances and automobiles.
在本文中，我们报道了一种新型的导热半芳香族耐热聚酰胺5T-CO-10T/六方氮化硼（PA5T-CO-10T/BN）复合材料，该复合材料基于合成的PA5T-CO-10T，PA5T-CO-10T是聚（戊二胺对苯二甲酰胺）（PA5T）和聚（癸二胺对苯二甲酰胺）（PA10T）的共聚物。我们通过核磁共振碳谱仪（C-NMR）确定了PA5T-CO-10T的结构。差示扫描量热法（DSC）和热重分析（TGA）结果表明，PA5T-CO-10T具有适合熔融加工和注塑成型的加工窗口（大于90°C）。此外，通过扫描电子显微镜（SEM）、导热系数仪、旋转流变仪和X射线衍射（XRD）对不同BN含量的PA5T-CO-10T复合材料进行了测试。结果表明，随着h-BN含量的增加，PA5T-CO-10T/BN复合材料的导热系数显著提高。当h-BN的质量达到30 wt%时，复合材料的导热系数是原始基体树脂的2.5倍。同时，h-BN的储能模量、损耗模量、复数粘度和取向度呈现出显著的上升趋势。这归因于h-BN的高导热性和高取向度，确保了材料导热系数的持续提高。此外，h-BN的引入增强了材料分子链之间的连接程度。PA5T-CO-10T/BN具有优异的耐热性和导热性，在电子、电器和汽车领域具有显著的应用前景。
