Rim Minwoo, Pham Huan Huu, Lee Hyerim, Hyeong Jaeseok, Wi Youngjae, Koo Jahyeon, Tran Duy Thanh, Na Seok-In, Kang Dong-Gue, Jeong Kwang-Un
Department of Polymer-Nano Science and Technology, Department of Nano Convergence Engineering, Jeonbuk National University, Jeonju, 54896, Republic of Korea.
Department of Flexible and Printable Electronics and LANL-JBNU Engineering Institute-Korea, Jeonbuk National University, Jeonju, 54896, Republic of Korea.
Angew Chem Int Ed Engl. 2025 Jul 21;64(30):e202504825. doi: 10.1002/anie.202504825. Epub 2025 May 16.
To boost up the properties of thermally conductive polymer composites, it is essential to conduct comprehensive research focused on interface engineering between the polymer matrix and fillers. Hexagonal boron nitride (BN) or expanded graphite (EG) are commonly utilized as nanofillers to improve the thermal conductivity of polymer composites. However, the interfacial interactions between the polymer matrix and nanofillers are generally weak, making effective thermal conductivity challenging. To address this issue, we have designed and synthesized an electron-rich and aromatic tetrathiafulvalene-based reactive mesogen (TRM), which not only possesses high thermal conductivity but also exhibits excellent interfacial affinity with BN and EG at the molecular level. Systematic experiments, including photophysical, thermodynamic, structural, and computational analyses, reveal that the thermal conductivity of TRM-based polymer composites is substantially enhanced due to effective interfacial interactions between TRM and fillers. The TRM composites experimentally show excellent thermal conductivity based on enhanced interfacial phonon transfer, and these results are supported by theoretical interpretations. These findings underscore the critical importance of interface engineering between the polymer matrix and fillers at the molecular level in maximizing the material properties of polymer composites.
为了提高导热聚合物复合材料的性能,有必要开展聚焦于聚合物基体与填料之间界面工程的全面研究。六方氮化硼(BN)或膨胀石墨(EG)通常用作纳米填料来提高聚合物复合材料的热导率。然而,聚合物基体与纳米填料之间的界面相互作用通常较弱,这使得有效提高热导率具有挑战性。为了解决这个问题,我们设计并合成了一种富电子且基于芳香四硫富瓦烯的反应性液晶基元(TRM),它不仅具有高导热率,而且在分子水平上与BN和EG表现出优异的界面亲和力。包括光物理、热力学、结构和计算分析在内的系统实验表明,由于TRM与填料之间有效的界面相互作用,基于TRM的聚合物复合材料的热导率得到了显著提高。基于增强的界面声子传递,TRM复合材料在实验中表现出优异的热导率,这些结果得到了理论解释的支持。这些发现强调了在分子水平上聚合物基体与填料之间的界面工程对于最大化聚合物复合材料材料性能的至关重要性。