Chen Zhongping, Yang Yang, Lou Huafen, Wang Hu
School of Material Science and Engineering, Central South University, Changsha 410083, China.
Chinalco Research Institute of Science and Technology Co., Ltd., Beijing 102209, China.
Materials (Basel). 2025 Apr 24;18(9):1941. doi: 10.3390/ma18091941.
Grain boundary engineering (GBE) has been widely used to modify grain boundary (GB) networks to improve GB-related properties in polycrystalline materials. With the development of miniaturized and lightweight terminal connectors comes a greater demand for phosphorus bronze. A fine grain size and excellent GB characteristics are the keys to synergistically enhancing mechanical strength and bending workability. In this study, the effects of the annealing temperature on the grain boundary character distribution (GBCD) optimization and the bending properties of phosphorus bronze were studied by means of electron backscatter diffraction and a 90° bending test. The results show that the deformed microstructure of the as-received material recrystallizes upon annealing at 400 °C for 1 h. The average grain size is 1.6 μm, and a large number of special boundaries (SBs) are present, accounting for 71.5% of all GBs. Further, the incoherent Σ3, Σ9, and Σ27 boundaries are the most abundant, effectively disrupting the network connectivity of random high-angle grain boundaries. The grain size gradually increases with the annealing temperature increase. The fractions of the Σ9 and Σ27 boundaries gradually decrease. Although the proportion of SBs further increases at higher temperatures, most SBs at these temperatures are coherent Σ3 boundaries that do not contribute to the direct optimization of GBCD. Moreover, in the absence of a significant difference in tensile strength, the GBCD-optimized fine-grained sample demonstrates smooth surfaces without orange peel effects when bent at 90° with R/t = 0 in the bad way. This improvement is attributed to the uniform deformation of fine grains and special boundaries, which enhances the bending workability of the GBCD-optimized fine-grained strips.
晶界工程(GBE)已被广泛用于修饰晶界(GB)网络,以改善多晶材料中与晶界相关的性能。随着小型化和轻量化终端连接器的发展,对磷青铜的需求也日益增加。细晶粒尺寸和优异的晶界特性是协同提高机械强度和弯曲加工性能的关键。在本研究中,通过电子背散射衍射和90°弯曲试验,研究了退火温度对磷青铜晶界特征分布(GBCD)优化和弯曲性能的影响。结果表明,经400℃退火1 h后,原始材料的变形微观组织发生再结晶。平均晶粒尺寸为1.6μm,存在大量特殊晶界(SBs),占所有晶界的71.5%。此外,非共格的Σ3、Σ9和Σ27晶界最为丰富,有效地破坏了随机大角度晶界的网络连通性。随着退火温度的升高,晶粒尺寸逐渐增大。Σ9和Σ27晶界的比例逐渐降低。尽管在较高温度下SBs的比例进一步增加,但这些温度下的大多数SBs是共格的Σ3晶界,对GBCD的直接优化没有贡献。此外,在抗拉强度没有显著差异的情况下,GBCD优化的细晶粒样品在以不良方式进行R/t = 0的90°弯曲时,表面光滑,无橘皮效应。这种改善归因于细晶粒和特殊晶界的均匀变形,增强了GBCD优化的细晶粒带材的弯曲加工性能。