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铜中的超高强度和高导电性。

Ultrahigh strength and high electrical conductivity in copper.

作者信息

Lu Lei, Shen Yongfeng, Chen Xianhua, Qian Lihua, Lu K

机构信息

Shenyang National Laboratory for Materials Science (SYNL), Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, P.R. China.

出版信息

Science. 2004 Apr 16;304(5669):422-6. doi: 10.1126/science.1092905. Epub 2004 Mar 18.

Abstract

Methods used to strengthen metals generally also cause a pronounced decrease in electrical conductivity, so that a tradeoff must be made between conductivity and mechanical strength. We synthesized pure copper samples with a high density of nanoscale growth twins. They showed a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper. The ultrahigh strength originates from the effective blockage of dislocation motion by numerous coherent twin boundaries that possess an extremely low electrical resistivity, which is not the case for other types of grain boundaries.

摘要

用于强化金属的方法通常也会导致电导率显著下降,因此必须在导电性和机械强度之间进行权衡。我们合成了具有高密度纳米级生长孪晶的纯铜样品。它们的抗拉强度比传统粗晶铜高约10倍,同时保持了与纯铜相当的电导率。超高强度源于大量具有极低电阻率的相干孪晶界对位错运动的有效阻碍,而其他类型的晶界则并非如此。

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