Hou Yingqi, Gao Yufei, Yang Chunfeng
Key Laboratory of High Efficiency and Clean Mechanical Manufacture of MOE, School of Mechanical Engineering, Shandong University, Jinan 250061, China.
State Key Laboratory of Advanced Equipment and Technology for Metal Forming, Shandong University, Jinan 250061, China.
Materials (Basel). 2025 May 24;18(11):2461. doi: 10.3390/ma18112461.
Single sapphire crystals has been widely used in technology such as light emitting diodes, lasers, high-temperature and high-voltage devices, special windows, and optical systems, and grinding is an important process of their machining. In order to reveal the influence of the grinding wheel speed, grinding depth, and feed rate on the ground surface quality of sapphire crystals, a three-factor and five-level orthogonal experiment was designed and completed. Variance and range analysis was conducted on the experimental results using the surface roughness and subsurface crack damage depth (SSD) as evaluation indicators, and optimized parameter combinations were explored. Furthermore, mathematical prediction models for the power regression of the and SSD were established based on the experimental data. The research results indicate that within the range of the process parameters used in this experiment, the grinding process did not achieve the full ductile removal of the material. Some of the material was removed in a brittle mode, forming fractured pits on the ground surface, and median crack propagation occurred in the subsurface, forming a subsurface microcrack damage layer. The influence of the grinding parameters on the and SSD showed a consistent trend, which was that the parameter with the greatest impact was the grinding wheel speed, followed by the feed rate and grinding depth. The and SSD obtained under the optimized grinding parameter combination were 0.326 μm and 2.86 μm, respectively. The research results provide an experimental basis and guidance for improving the surface quality of sapphire crystals during grinding.
单晶硅蓝宝石已广泛应用于发光二极管、激光器、高温高压器件、特殊窗口和光学系统等技术领域，磨削是其加工过程中的一个重要环节。为了揭示砂轮速度、磨削深度和进给速度对蓝宝石晶体磨削表面质量的影响，设计并完成了一项三因素五水平的正交试验。以表面粗糙度和亚表面裂纹损伤深度（SSD）为评价指标，对试验结果进行方差分析和极差分析，并探索优化的参数组合。此外，基于试验数据建立了表面粗糙度和SSD的幂回归数学预测模型。研究结果表明，在本试验所采用的工艺参数范围内，磨削过程并未实现材料的完全延性去除。部分材料以脆性模式去除，在磨削表面形成断裂凹坑，亚表面发生中位裂纹扩展，形成亚表面微裂纹损伤层。磨削参数对表面粗糙度和SSD的影响趋势一致，其中影响最大的参数是砂轮速度，其次是进给速度和磨削深度。优化后的磨削参数组合下获得的表面粗糙度和SSD分别为0.326μm和2.86μm。研究结果为提高蓝宝石晶体磨削表面质量提供了试验依据和指导。
