Lee Haksung, Choi Man Kwon, Kang Seong-Hyun, Han Woong, Kim Byung-Joo, Kim Kwan-Woo
Reclaimed Land Agricultural Research Center, National Institute of Crop and Food Science, RDA, Wanju 55365, Republic of Korea.
National Institute of Horticulture and Herbal Science, RDA, Haman 52054, Republic of Korea.
Polymers (Basel). 2025 Jun 10;17(12):1610. doi: 10.3390/polym17121610.
With the growing integration of electronic systems into modern infrastructure, the need for effective electromagnetic interference (EMI) shielding materials has intensified. This study explores the development of electroless Ni-plated fiber composites and systematically investigates the effects of post-heat treatment on their electrical, structural, and interfacial performance. Both carbon fibers (CFs) and glass fibers (GFs) were employed as reinforcing substrates, chosen for their distinct mechanical and thermal characteristics. Ni plating enhanced the electrical conductivity of both fibers, and heat treatment facilitated phase transformations from amorphous to crystalline NiP and NiP, leading to improved EMI shielding effectiveness (EMI-SE). NGF-based composites achieved up to a 169% increase in conductivity and a 116% enhancement in EMI-SE after treatment at 400 °C, while NCF-based composites treated at 800 °C attained superior conductivity and shielding performance. However, thermal degradation and reduced interfacial shear strength (IFSS) were observed, particularly in GF-based systems. The findings highlight the importance of material-specific thermal processing to balance functional performance and structural reliability. This study provides critical insights for designing fiber-reinforced composites with optimized EMI shielding properties for application-driven use in next-generation construction materials and intelligent infrastructure.
随着电子系统越来越多地融入现代基础设施，对有效的电磁干扰（EMI）屏蔽材料的需求日益增加。本研究探索了化学镀镍纤维复合材料的发展，并系统地研究了后热处理对其电学、结构和界面性能的影响。碳纤维（CFs）和玻璃纤维（GFs）均被用作增强基材，选择它们是因其独特的机械和热特性。镀镍提高了两种纤维的导电性，热处理促进了从非晶态到晶态NiP和NiP的相变，从而提高了电磁干扰屏蔽效能（EMI-SE）。基于NGF的复合材料在400°C处理后，导电性提高了169%，EMI-SE提高了116%，而在800°C处理的基于NCF的复合材料具有更高的导电性和屏蔽性能。然而，观察到了热降解和界面剪切强度（IFSS）降低的情况，特别是在基于GF的体系中。研究结果突出了特定材料热处理对于平衡功能性能和结构可靠性的重要性。本研究为设计具有优化EMI屏蔽性能的纤维增强复合材料提供了关键见解，以便在下一代建筑材料和智能基础设施中实现应用驱动的用途。
