Li Weizhuo, Wang Xuan, Qu Mingzhe, Wang Xiaoming, Shi Jiahao
School of Intelligence and Civil Engineering, Harbin University, Harbin 150076, China.
Key Laboratory of Engineering Dielectrics and Application, Ministry of Education, Harbin University of Science and Technology, Harbin 150080, China.
Polymers (Basel). 2025 Jul 14;17(14):1929. doi: 10.3390/polym17141929.
Thermal conductive composite materials have excellent electrical insulation properties, low cost, and are lightweight, making them a promising alternative to traditional electronic packaging materials and enhancing the heat dissipation of integrated circuits. Due to the differences in specific surface area and volume, thermal conductive fillers have poor interface connections between the polymer and/or thermal conductive filler, thereby increasing phonon scattering and affecting thermal conductivity. This article uses bismaleimide resin as the matrix and h-BN as the thermal conductive filler. The evolution laws of thermal conductivity and dielectric properties of thermal conductive composite materials were systematically characterized through multi-scale filler control and gradient filling design. Among them, h-BN with a diameter of 10 μm has the most significant improvement in thermal conductivity. When the filling amount is 40 wt%, the thermal conductivity reaches 1.31 W/(m·K).
导热复合材料具有优异的电绝缘性能、低成本且重量轻，使其成为传统电子封装材料的有前途的替代品，并增强了集成电路的散热能力。由于比表面积和体积的差异，导热填料在聚合物和/或导热填料之间的界面连接较差，从而增加了声子散射并影响热导率。本文以双马来酰亚胺树脂为基体，以h-BN为导热填料。通过多尺度填料控制和梯度填充设计，系统地表征了导热复合材料的热导率和介电性能的演变规律。其中，直径为10μm的h-BN对热导率的改善最为显著。当填充量为40 wt%时，热导率达到1.31W/(m·K)。
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