Chen Xi, Fu Xin, Chen Zhansheng, Zhai Zaiteng, Miu Hongkang, Tao Peng
State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Shanghai 200240, China.
Shanghai Institute of Satellite Engineering, 3666 Yuanjiang Road, Minhang District, Shanghai 201109, China.
Nanomaterials (Basel). 2025 Jul 24;15(15):1148. doi: 10.3390/nano15151148.
Polyimide, a class of high-performance polymers, is renowned for its exceptional thermal stability, mechanical strength, and chemical resistance. However, in the context of high-integration and high-frequency electronic packaging, polyimides face critical challenges including relatively high dielectric constants, inadequate thermal conductivity, and mechanical brittleness. Recent advances have focused on molecular design and composite engineering strategies to address these limitations. This review first summarizes the intrinsic properties of polyimides, followed by a systematic discussion of chemical synthesis, surface modification approaches, molecular design principles, and composite fabrication methods. We comprehensively examine both conventional polymerization synthetic routes and emerging techniques such as microwave-assisted thermal imidization and chemical vapor deposition. Special emphasis is placed on porous structure engineering via solid-template and liquid-template methods. Three key modification strategies are highlighted: (1) surface modifications for enhanced hydrophobicity, chemical stability, and tribological properties; (2) molecular design for optimized dielectric performance and thermal stability; and (3) composite engineering for developing high-thermal-conductivity materials with improved mechanical strength and electromagnetic interference (EMI) shielding capabilities. The dielectric constant of polyimide is reduced while chemical stability and wear resistance can be enhanced through the introduction of fluorine groups. Ultra-low dielectric constant and high-temperature resistance can be achieved by employing rigid monomers and porous structures. Furthermore, the incorporation of fillers such as graphene and boron nitride can endow the composite materials with high thermal conductivity, excellent EMI shielding efficiency, and improved mechanical properties. Finally, we discuss representative applications of polyimide and composites in electronic device packaging, EMI shielding, and thermal management systems, providing insights into future development directions.
聚酰亚胺是一类高性能聚合物，以其卓越的热稳定性、机械强度和耐化学性而闻名。然而，在高集成度和高频电子封装的背景下，聚酰亚胺面临着关键挑战，包括相对较高的介电常数、不足的热导率和机械脆性。最近的进展集中在分子设计和复合工程策略上，以解决这些局限性。本文首先总结了聚酰亚胺的固有特性，随后系统地讨论了化学合成、表面改性方法、分子设计原则和复合材料制备方法。我们全面研究了传统的聚合合成路线以及新兴技术，如微波辅助热亚胺化和化学气相沉积。特别强调了通过固体模板和液体模板方法进行的多孔结构工程。突出了三种关键的改性策略：（1）表面改性以提高疏水性、化学稳定性和摩擦学性能；（2）分子设计以优化介电性能和热稳定性；（3）复合工程以开发具有改善的机械强度和电磁干扰（EMI）屏蔽能力的高导热材料。通过引入氟基团可以降低聚酰亚胺的介电常数，同时提高化学稳定性和耐磨性。采用刚性单体和多孔结构可以实现超低介电常数和耐高温性能。此外，加入石墨烯和氮化硼等填料可以赋予复合材料高导热性、优异的EMI屏蔽效率和改善的机械性能。最后，我们讨论了聚酰亚胺及其复合材料在电子器件封装、EMI屏蔽和热管理系统中的代表性应用，为未来的发展方向提供了见解。
