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工艺参数与熔透状态对1060/2A12异种铝合金电子束焊接接头气孔缺陷的影响及机理分析

Effect and Mechanism Analysis of Process Parameters and Penetration State on Pore Defects of 1060/2A12 Dissimilar Aluminum Alloy Electron Beam Welding Joints.

作者信息

Ma Guolong, Li Gangqing, Han Xiaohui, Jiang Chenghui, Cheng Zengci, Diao Wangzhan, Wang Houqin

机构信息

Technical Engineering Department, CRRC Qingdao Sifang Co., Ltd., Qingdao 266111, China.

State Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin Institute of Technology, Harbin 150001, China.

出版信息

Materials (Basel). 2025 Jul 24;18(15):3477. doi: 10.3390/ma18153477.

DOI:10.3390/ma18153477
PMID:40805355
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC12347499/
Abstract

Pore defects are one of the most common defects in the aluminum alloy electron beam welding process. In this paper, research on the pore defects and related mechanisms of the electron beam welding of dissimilar aluminum alloys was carried out with 1060 and 2A12 aluminum alloys. Under the test conditions, the pore defects of the aluminum alloy joint were related to the penetration status, the porosity of the critically penetrated joint was low, and the porosity of the beam joint increased when it was slightly penetrated. When the welding speed changed from 300 mm/min to 1200 mm/min, the porosity in the critically penetrated joint first increased and then decreased. When the welding speed was set to 300 mm/min and the beam current was set to 26 mA, the porosity of the joints reached its minimum value at 0.23%. Based on the actual process of electron beam welding, a flow simulation model was established to study the aluminum alloy welding process. The stability of the keyhole was related to the electron beam energy density reaching the inner keyhole, so increasing the electron beam for the fully penetrated joints was advantageous for reducing the pore defects.

摘要

气孔缺陷是铝合金电子束焊接过程中最常见的缺陷之一。本文以1060和2A12铝合金为研究对象,对异种铝合金电子束焊接的气孔缺陷及相关机理进行了研究。在试验条件下,铝合金接头的气孔缺陷与熔透状态有关,临界熔透接头的气孔率较低,微熔透时束流接头的气孔率增加。当焊接速度从300mm/min变化到1200mm/min时,临界熔透接头中的气孔率先增加后降低。当焊接速度设定为300mm/min且束流设定为26mA时,接头的气孔率在0.23%时达到最小值。基于电子束焊接的实际过程,建立了流动模拟模型来研究铝合金焊接过程。小孔的稳定性与到达小孔内部的电子束能量密度有关,因此增加全熔透接头的电子束有利于减少气孔缺陷。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1db1/12347499/a9ce4dae25a1/materials-18-03477-g012.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1db1/12347499/a9ce4dae25a1/materials-18-03477-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1db1/12347499/70c18d5c064d/materials-18-03477-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1db1/12347499/ac90b935c4ab/materials-18-03477-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1db1/12347499/450e06c8a31f/materials-18-03477-g003.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1db1/12347499/d8e050bedb9b/materials-18-03477-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1db1/12347499/6540b9d8e9de/materials-18-03477-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1db1/12347499/516fb91f3fc3/materials-18-03477-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1db1/12347499/cbc33248a2f0/materials-18-03477-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1db1/12347499/99964cea16b0/materials-18-03477-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1db1/12347499/054d9f77147c/materials-18-03477-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1db1/12347499/a9ce4dae25a1/materials-18-03477-g012.jpg

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