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一种新型多晶硅填充增强型穿通3D沟槽电极探测器:制造方法及电学性能模拟

A Novel Polysilicon-Fill-Strengthened Etch-Through 3D Trench Electrode Detector: Fabrication Methods and Electrical Property Simulations.

作者信息

Zhu Xuran, Li Zheng, Liu Zhiyu, Long Tao, Zhao Jun, Li Xinqing, Liu Manwen, Wang Meishan

机构信息

School of Integrated Circuits, Ludong University, Yantai 264025, China.

Engineering Research Center of Photo Detector Special Chip in Universities of Shandong, Ludong University, Yantai 264025, China.

出版信息

Micromachines (Basel). 2025 Aug 6;16(8):912. doi: 10.3390/mi16080912.

Abstract

Three-dimensional trench electrode silicon detectors play an important role in particle physics research, nuclear radiation detection, and other fields. A novel polysilicon-fill-strengthened etch-through 3D trench electrode detector is proposed to address the shortcomings of traditional 3D trench electrode silicon detectors; for example, the distribution of non-uniform electric fields, asymmetric electric potential, and dead zone. The physical properties of the detector have been extensively and systematically studied. This study simulated the electric field, potential, electron concentration distribution, complete depletion voltage, leakage current, capacitance, transient current induced by incident particles, and weighting field distribution of the detector. It also systematically studied and analyzed the electrical characteristics of the detector. Compared to traditional 3D trench electrode silicon detectors, this new detector adopts a manufacturing process of double-side etching technology and double-side filling technology, which results in a more sensitive detector volume and higher electric field uniformity. In addition, the size of the detector unit is 120 µm × 120 µm × 340 µm; the structure has a small fully depleted voltage, reaching a fully depleted state at around 1.4 V, with a saturation leakage current of approximately 4.8×10-10A, and a geometric capacitance of about 99 fF.

摘要

三维沟槽电极硅探测器在粒子物理研究、核辐射探测等领域发挥着重要作用。针对传统三维沟槽电极硅探测器存在的电场分布不均匀、电势不对称以及死区等缺点,提出了一种新型的多晶硅填充增强型穿透蚀刻三维沟槽电极探测器。对该探测器的物理特性进行了广泛而系统的研究。本研究模拟了探测器的电场、电势、电子浓度分布、完全耗尽电压、漏电流、电容、入射粒子感应的瞬态电流以及加权场分布。还对探测器的电学特性进行了系统的研究和分析。与传统三维沟槽电极硅探测器相比,这种新型探测器采用了双面蚀刻技术和双面填充技术的制造工艺,从而使探测器体积更灵敏,电场均匀性更高。此外,探测器单元尺寸为120 µm×120 µm×340 µm;该结构具有较小的完全耗尽电压,在约1.4 V时达到完全耗尽状态,饱和漏电流约为4.8×10-10A,几何电容约为99 fF。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3c6/12388708/49db95b3039d/micromachines-16-00912-g001.jpg

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