Menold R, Lüttge B
Microsc Acta. 1979 Mar;81(4):317-27.
The physical processes occuring while the fracture face of a dispersion is being freeze-etched are described and the resulting opportunities for elimination of contamination phenomena are discussed. An anticontamination device which can be used in combination with a drop freeze-fracture apparatus is described. The main advantages of the device, high effectiveness and great simplicity, are demonstrated by several practical examples.
描述了分散体断裂面进行冷冻蚀刻时发生的物理过程，并讨论了由此消除污染现象的机会。介绍了一种可与滴液冷冻断裂装置结合使用的防污染装置。通过几个实际例子展示了该装置的主要优点，即高效性和极大的简易性。
