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体外从猿猴病毒40微小染色体中切除嘧啶二聚体的修复过程

Excision repair of pyrimidine dimers from simian virus 40 minichromosomes in vitro.

作者信息

Evans D H, Linn S

出版信息

J Biol Chem. 1984 Aug 25;259(16):10252-9.

PMID:6088490
Abstract

The ability of DNA repair enzymes to carry out excision repair of pyrimidine dimers in SV40 minichromosomes irradiated with 16 to 64 J/m2 of UV light was examined. Half of the dimers were substrate for the DNA glycosylase activity of phage T4 UV endonuclease immediately after irradiation, but this limit decreased to 27% after 2 h at 0 degrees C. Moreover, the apyrimidinic (AP) endonuclease activity of the enzyme did not incise all of the AP sites created by glycosylase activity, although all AP sites were substrate for HeLa AP endonuclease II. The initial rate of the glycosylase was 40% that upon DNA. After incision by the T4 enzyme, excision was mediated by HeLa DNase V (acting with an exonuclease present in the chromatin preparation). Under physiological salt conditions, excision did not proceed appreciably beyond the damaged nucleotides in DNA or chromatin. With chromatin, about 70% of the accessible dimers were removed, but at a rate slower than for DNA. Finally, HeLa DNA polymerase beta was able to fill the short gaps created after dimer excision, and these patches were sealed by T4 DNA ligase. Overall, roughly 30% of the sites incised by the endonuclease were ultimately sealed by the ligase. The resistance of some sites was due to interference with the ligase by the chromatin structure, as only 30-40% of the nicks created in chromatin by pancreatic DNase could be sealed by T4 or HeLa DNA ligases. The overall excision repair process did not detectably disrupt the chromatin structure, since the repair label was recovered in Form I DNA present in 75 S condensed minichromosomes. Although other factors might stimulate the rate of this repair process, it appears that the enzymes utilized could carry out excision repair of chromatin to a limit near that observed at the initial rate in mammalian cells in vivo.

摘要

研究了DNA修复酶对经16至64 J/m²紫外线照射的SV40微型染色体中嘧啶二聚体进行切除修复的能力。照射后立即有一半的二聚体是噬菌体T4紫外线内切酶DNA糖基化酶活性的底物,但在0℃下放置2小时后,这一比例降至27%。此外,该酶的脱嘧啶(AP)内切酶活性并未切割糖基化酶活性产生的所有AP位点,尽管所有AP位点都是HeLa AP内切酶II的底物。糖基化酶的初始速率是在DNA上时的40%。经T4酶切割后,切除由HeLa DNase V介导(与染色体制备物中存在的一种核酸外切酶共同作用)。在生理盐条件下,切除在DNA或染色质中受损核苷酸之外的进程并不明显。对于染色质,约70%可及的二聚体被去除,但速率比DNA慢。最后,HeLa DNA聚合酶β能够填补二聚体切除后产生的短缺口,这些片段由T4 DNA连接酶封闭。总体而言,内切酶切割的位点中约30%最终被连接酶封闭。一些位点的抗性是由于染色质结构对连接酶的干扰,因为胰腺DNase在染色质中产生的切口只有30 - 40%能被T4或HeLa DNA连接酶封闭。整体切除修复过程未明显破坏染色质结构,因为修复标记物在75 S浓缩微型染色体中的I型DNA中被回收。尽管其他因素可能会刺激这一修复过程的速率,但似乎所使用的酶能够对染色质进行切除修复,其限度接近在体内哺乳动物细胞中观察到的初始速率。

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