Thoupos G A, Zouras C S, Winkler S, Roussos V G
Department of Prosthodontics, Temple University School of Dentistry, Philadelphia, Pennsylvania 19140-5096, USA.
Implant Dent. 1995 Summer;4(2):97-9. doi: 10.1097/00008505-199505000-00004.
Indexing and soldering an implant bar can be a troublesome procedure. The expansion of the soldering investment may result in an inaccurate fit of the implant framework over the abutments or the implant heads. To overcome the distortion of the implant framework during soldering, a simple procedure for connecting the implant framework parts is described where the connector joints are cast-to rather than soldered.
对种植体杆进行索引和焊接可能是一个麻烦的过程。焊接包埋料的膨胀可能会导致种植体支架在基台或种植体头部的就位不准确。为了克服焊接过程中种植体支架的变形，本文描述了一种连接种植体支架部件的简单方法，即连接器接头采用铸造而非焊接的方式。
