Wang W N, Yeh C L, Fang B D, Sun K T, Arvystas M G
Department of Dentistry, Tri-Service General Hospital, Taipei, Taiwan.
Angle Orthod. 1994;64(5):377-82. doi: 10.1043/0003-3219(1994)064<0377:EOHCOB>2.0.CO;2.
Prior to bonding, the enamel surface of the tooth is normally etched using a solution of 37%-50% phosphoric acid (H3PO4) for 60 seconds. The purpose of this study was to evaluate the tensile bond strength, debonding interface distribution and enamel surface detachment of various concentrations of H3PO4 solution, from 2% to 80%, applied for 15 seconds. Statistically significant differences in bond strength were found among the various concentrations tested: concentrations in the 10% to 60% range produced greater bond strengths than both the weaker and stronger concentrations. The weaker the bond strength, the greater the debonding interface between resin and enamel. The greater the bond strength, the greater the debonding interface between the bracket and resin. Enamel detachment occurred as the H3PO4 concentration rose above 30%. To obtain greater bond strength and less enamel detachment, 10%-30% concentrations of phosphoric acid for 15 seconds etching are suggested for clinical bonding.
在粘结之前,通常使用37%-50%的磷酸(H3PO4)溶液对牙齿的釉质表面进行蚀刻60秒。本研究的目的是评估2%至80%不同浓度的H3PO4溶液在蚀刻15秒时的拉伸粘结强度、脱粘界面分布和釉质表面脱离情况。在所测试的不同浓度之间发现粘结强度存在统计学上的显著差异:10%至60%范围内的浓度产生的粘结强度高于较弱和较强的浓度。粘结强度越弱,树脂与釉质之间的脱粘界面越大。粘结强度越大,托槽与树脂之间的脱粘界面越大。当H3PO4浓度超过30%时会发生釉质脱离。为获得更大的粘结强度和更少的釉质脱离,建议临床粘结时使用10%-30%浓度的磷酸蚀刻15秒。