Kusakabe T, Koga K, Sugimoto Y
Department of Biochemistry, Faculty of Medicine, Saga Medical School, Japan.
Biochim Biophys Acta. 1994 Oct 18;1219(2):555-8. doi: 10.1016/0167-4781(94)90088-4.
A cDNA encoding for a heat shock protein 30 (HSP30) of Aspergillus nidulans and the promoter region of its gene were analyzed for their primary structures. The promoter region had no heat shock element but possessed three inverted repeat sequences. Northern blot hybridization indicated that the expression of the HSP30 gene was high at a normal temperature and was slightly accelerated at elevated temperatures in A. nidulans cells. Although the deduced amino acid sequence of the A. nidulans HSP30 had a domain highly conserved among other small HSPs from different species, it showed a sequence homology of only 42% even in comparison with the most closely related molecular species, Neurospora crassa HSP30. These findings suggest that the present HSP30 belongs to a novel subfamily of low-molecular-weight HSPs.
对构巢曲霉热休克蛋白30(HSP30)的编码cDNA及其基因的启动子区域进行了一级结构分析。该启动子区域没有热休克元件,但有三个反向重复序列。Northern印迹杂交表明,HSP30基因在构巢曲霉细胞中的表达在正常温度下较高,在温度升高时略有加速。尽管构巢曲霉HSP30推导的氨基酸序列在来自不同物种的其他小HSP中具有高度保守的结构域,但与最密切相关的分子种粗糙脉孢菌HSP30相比,其序列同源性仅为42%。这些发现表明,目前的HSP30属于低分子量HSP的一个新亚家族。