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使用双标记穿梭载体研究酿酒酵母野生型和辐射敏感突变体中的DNA双链断裂修复。

The use of a double-marker shuttle vector to study DNA double-strand break repair in wild-type and radiation-sensitive mutants of the yeast Saccharomyces cerevisiae.

作者信息

Jha B, Ahne F, Eckardt-Schupp F

机构信息

Botany Department, L. N. Mithila University, Darbhanga, India.

出版信息

Curr Genet. 1993 May-Jun;23(5-6):402-7. doi: 10.1007/BF00312626.

Abstract

An episomal DNA vector (YpJA18), encoding two selectable recombinant yeast genes (TRP1, URA3), was constructed to assess the fidelity of DNA repair in haploid repair-competent (RAD) wild-type yeast and several radiation-sensitive mutants. Either a DNA double-strand break (DSB) or a double-strand gap of 169 bp (DSG) was introduced by restriction enzymes in-vitro within the coding sequence of the URA3 gene of this vector. To eliminate transfer artefacts, selection was first applied for the undamaged TRP1 gene followed by counter selection for URA3 gene activity, which indicated correct repair of the DSB and DSG. Correct repair of the damaged URA3 gene was found to be about 90% in RAD cells (normalized for the expression of undamaged URA3 in TRP+ transformants). Plasmids isolated from the transformants (URA+TRP+) carry both unique sites (ApaI and NcoI) within the URA3 gene indicating the precise restitution of the 169-bp gap. An excision-repair-defective rad4-4 mutant repaired these lesions as correctly as RAD cells, whereas the mutants rad50-1, rad51-1 and rad54-1, proven to be defective in DSB repair and mitotic recombination, showed less than 5% correct repair of such lesions. In contrast, a representative of the RAD6 epistasis group of genes, the rev2-1 mutant which is sensitive towards UV and ionizing radiation, had a significantly reduced ability (about 20%) for the correct repair of both DSBs and DSGs.

摘要

构建了一种附加型DNA载体(YpJA18),其编码两个可选择的重组酵母基因(TRP1、URA3),用于评估单倍体有修复能力(RAD)的野生型酵母及几种辐射敏感突变体中DNA修复的保真度。通过限制性内切酶在体外该载体URA3基因的编码序列内引入DNA双链断裂(DSB)或169 bp的双链缺口(DSG)。为消除转移假象,首先针对未受损的TRP1基因进行选择,随后针对URA3基因活性进行反选择,这表明DSB和DSG得到了正确修复。发现在RAD细胞中受损URA3基因的正确修复率约为90%(针对TRP +转化体中未受损URA3的表达进行标准化)。从转化体(URA +TRP +)中分离的质粒在URA3基因内携带两个独特位点(ApaI和NcoI),表明169 bp缺口得到了精确修复。切除修复缺陷型rad4 - 4突变体修复这些损伤的情况与RAD细胞一样正确,而经证实存在DSB修复和有丝分裂重组缺陷的突变体rad50 - 1、rad51 - 1和rad54 - 1,对这类损伤的正确修复率不到5%。相比之下,RAD6上位性基因群的一个代表,即对紫外线和电离辐射敏感的rev2 - 1突变体,对DSB和DSG的正确修复能力显著降低(约20%)。

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