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酿酒酵母中质粒DNA双链缺口修复的遗传控制

Genetic control of plasmid DNA double-strand gap repair in yeast, Saccharomyces cerevisiae.

作者信息

Glaser V M, Glasunov A V, Tevzadze G G, Perera J R, Shestakov S V

机构信息

Department of Genetics, Moscow State University, USSR.

出版信息

Curr Genet. 1990 Jul;18(1):1-5. doi: 10.1007/BF00321107.

DOI:10.1007/BF00321107
PMID:2245471
Abstract

The repair of double-strand gaps (DSGs) in the plasmid DNA of radiosensitive mutants of Saccharomyces cerevisiae has been analyzed. The proportion of repair events that resulted in complete plasmid DNA DSG recovery was close to 100% in Rad+ cells. Mutation rad55 does not influence the efficiency and preciseness of DSG repair. The mutant rad57, which is capable of recombinational DNA DSB repair, resulted in no DSG recovery. Mutation rad53 substantially inhibits the efficiency of DSG repair but does not influence the precision of repair. Plasmid DNA DSG repair is completely blocked by mutations rad50 and rad54.

摘要

对酿酒酵母辐射敏感突变体的质粒DNA中的双链缺口(DSG)修复进行了分析。在Rad+细胞中,导致质粒DNA DSG完全恢复的修复事件比例接近100%。rad55突变不影响DSG修复的效率和准确性。能够进行重组DNA DSB修复的rad57突变体未导致DSG恢复。rad53突变显著抑制DSG修复的效率,但不影响修复的准确性。rad50和rad54突变完全阻断了质粒DNA DSG修复。

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[Repair of a double-stranded gap in plasmid DNA in radiosensitive mutants of Saccharomyces cerevisiae: effectiveness and precision].[酿酒酵母辐射敏感突变体中质粒DNA双链缺口的修复:有效性和精确性]
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RAD51 is required for the repair of plasmid double-stranded DNA gaps from either plasmid or chromosomal templates.

本文引用的文献

1
Mitotic intragenic recombination in the yeast Saccharomyces: marker-effects on conversion and reciprocity of recombination.酵母属中染色体内有丝分裂基因重组:转化和重组互逆的标记效应。
Curr Genet. 1984 Dec;9(1):31-7. doi: 10.1007/BF00396201.
2
Repair of double-strand breaks in a temperature conditional radiation-sensitive mutant of Saccharomyces cerevisiae.酿酒酵母温度条件辐射敏感突变体中双链断裂的修复
Mutat Res. 1982 Jan;103(1):19-24. doi: 10.1016/0165-7992(82)90080-x.
3
Rbe of densely ionizing radiation for wild-type and radiosensitive mutants of yeast.
RAD51对于从质粒或染色体模板修复质粒双链DNA缺口是必需的。
Mol Cell Biol. 2000 Feb;20(4):1194-205. doi: 10.1128/MCB.20.4.1194-1205.2000.
4
In-vitro recombination in rad and rnc mutants of Saccharomyces cerevisiae.酿酒酵母rad和rnc突变体中的体外重组
Curr Genet. 1993 Jan;23(1):1-8. doi: 10.1007/BF00336741.
5
The use of a double-marker shuttle vector to study DNA double-strand break repair in wild-type and radiation-sensitive mutants of the yeast Saccharomyces cerevisiae.使用双标记穿梭载体研究酿酒酵母野生型和辐射敏感突变体中的DNA双链断裂修复。
Curr Genet. 1993 May-Jun;23(5-6):402-7. doi: 10.1007/BF00312626.
6
Influence of non-homology between recombining DNA sequences on double-strand break repair in Saccharomyces cerevisiae.重组DNA序列间的非同源性对酿酒酵母双链断裂修复的影响。
Mol Gen Genet. 1995 Apr 10;247(1):55-60. doi: 10.1007/BF00425821.
7
Differential repair and recombination of psoralen damaged plasmid DNA in Saccharomyces cerevisiae.酿酒酵母中补骨脂素损伤质粒DNA的差异修复与重组
Mol Gen Genet. 1992 Dec;236(1):8-16. doi: 10.1007/BF00279637.
酵母野生型和辐射敏感突变体对密集电离辐射的相对生物学效应
Mutat Res. 1981 Jul;82(2):285-94. doi: 10.1016/0027-5107(81)90158-5.
4
Genetic control of diploid recovery after gamma-irradiation in the yeast Saccharomyces cerevisiae.酿酒酵母经γ射线辐照后二倍体恢复的遗传控制。
Mutat Res. 1980 Dec;73(2):251-65. doi: 10.1016/0027-5107(80)90192-x.
5
The linear relationship between DNA double-strand breaks and radiation dose (30 MeV electrons) is converted into a quadratic function by cellular repair.
Int J Radiat Biol Relat Stud Phys Chem Med. 1980 Feb;37(2):207-12. doi: 10.1080/09553008014550251.
6
[Disorder of the repair of DNA double-stranded breaks in radiosensitive mutants of Saccharomyces cerevisiae yeasts].[酿酒酵母辐射敏感突变体中DNA双链断裂修复的紊乱]
Genetika. 1983;19(1):26-32.
7
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Proc Natl Acad Sci U S A. 1983 Jul;80(14):4417-21. doi: 10.1073/pnas.80.14.4417.
8
Yeast transformation: a model system for the study of recombination.酵母转化:用于重组研究的模型系统。
Proc Natl Acad Sci U S A. 1981 Oct;78(10):6354-8. doi: 10.1073/pnas.78.10.6354.
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Mutat Res. 1974 Sep;24(3):281-92. doi: 10.1016/0027-5107(74)90176-6.
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The use of plasmid DNA to probe DNA repair functions in the yeast Saccharomyces cerevisiae.
Mol Gen Genet. 1985;201(1):99-106. doi: 10.1007/BF00397993.