Hansen E K, Asmussen E
Department of Dental Materials and Technology, Royal Dental College, Copenhagen, Denmark.
Scand J Dent Res. 1993 Jun;101(3):176-9. doi: 10.1111/j.1600-0722.1993.tb01659.x.
The temperature rise, caused by 10 different curing units, in a prepolymerized resin specimen was examined. For all units, the temperature increase in a 60-s cycle followed a logarithmic curve, with the most effective light sources giving the highest temperature rise. In the surface layer the change of temperature ranged between 3.6 and 29.2 degrees C, and 3.2 mm below the irradiated surface between 1.5 and 12.3 degrees C. The use of a 2-mm-thick isolating layer of glass ionomer resulted in a significant reduction in the temperature increase. The correlation between the depth of cure and the temperature rise was of an exponential or power nature; i.e., a small increase of the depth of cure was followed by a disproportionately high increase in temperature.
研究了由10种不同固化设备引起的预聚合树脂试样的温度升高情况。对于所有设备，60秒周期内的温度升高遵循对数曲线，最有效的光源导致最高的温度升高。在表层，温度变化范围为3.6至29.2摄氏度，在照射表面以下3.2毫米处为1.5至12.3摄氏度。使用2毫米厚的玻璃离子隔离层可显著降低温度升高。固化深度与温度升高之间的相关性呈指数或幂次性质；即，固化深度的小幅增加之后是温度不成比例的大幅升高。
