Messerschmidt A, Luecke H, Huber R
Max-Planck-Institut für Biochemie, Martinsried, FRG.
J Mol Biol. 1993 Apr 5;230(3):997-1014. doi: 10.1006/jmbi.1993.1215.
The X-ray structures of three functional derivatives of ascorbate oxidase (EC 1.10.3.3) from Zucchini have been determined and are compared to the "native" oxidized form. The fully reduced form of ascorbate oxidase has been refined to a crystallographic R-factor of 19.6% for all reflections between 8.0 A and 2.2 A resolution. The geometry at the type-1 copper (CU1) is unchanged compared to the oxidized form, but the oxygen ligand bridging the copper ions CU2 and CU3 (spectroscopic type-3 copper pair) is released and the copper ions move apart yielding a trigonal planar co-ordination with their ligating histidine residues. The co-ordination at the copper ion CU4 (spectroscopic type-2 copper) is not affected. The copper-copper distances increase from an average 3.7 A in the native form to 5.1 A for CU2-CU3, 4.4 A for CU2-CU4 and 4.1 A for CU3-CU4. The peroxide derivative of ascorbate oxidase has been refined to a crystallographic R-factor of 16.0% for all reflections between 8.0 A and 2.59 A resolution. The geometry at the type-1 copper site is not changed compared to the oxidized form. The oxygen ligand bridging copper atoms CU2 and CU3 is lost, too. The peroxide binds terminally to the copper ion CU2 as hydroperoxide. Copper ion CU2 is fourfold co-ordinated to the NE2 atoms of the three histidine residues and to the oxygen atom of the terminally bound peroxide molecule in a distorted tetrahedral geometry. Copper ion CU3 is threefold co-ordinated as in the reduced form and co-ordination around copper atom CU4 is unaltered. The copper-copper distances increase to 4.8 A for CU2-CU3 and 4.5 A for CU2-CU4. The distance CU3-CU4 remains 3.7 A. Treatment with peroxide causes a partial depletion of copper ion CU2. The refinement for the azide derivative of ascorbate oxidase converged at a crystallographic R-factor of 17.8% for all reflections between 8.0 A and 2.32 A. There are no significant structural changes at the type-1 copper site. The oxygen ligand bridging copper ions CU2 and CU3 is again released. Two azide molecules bind terminally to copper ion CU2. Copper ion CU2 is fivefold co-ordinated to the NE2 atoms of the three histidine residues and to both terminally bound azide molecules in a trigonal-bipyramidal manner. Copper-copper distances increase to 5.1 A for CU2-CU3 and 4.6 A for CU2-CU4. The distance CU3-CU4 is decreased to 3.6 A.(ABSTRACT TRUNCATED AT 400 WORDS)
已测定了来自西葫芦的抗坏血酸氧化酶(EC 1.10.3.3)三种功能衍生物的X射线结构,并与“天然”氧化形式进行了比较。抗坏血酸氧化酶的完全还原形式已针对8.0 Å至2.2 Å分辨率之间的所有反射精修至晶体学R因子为19.6%。与氧化形式相比,1型铜(CU1)处的几何结构未发生变化,但桥接铜离子CU2和CU3的氧配体(光谱学3型铜对)被释放,铜离子分开,与其连接的组氨酸残基形成三角平面配位。铜离子CU4(光谱学2型铜)处的配位未受影响。铜-铜距离从天然形式的平均3.7 Å增加到CU2-CU3为5.1 Å、CU2-CU4为4.4 Å、CU3-CU4为4.1 Å。抗坏血酸氧化酶的过氧化物衍生物已针对8.0 Å至2.59 Å分辨率之间的所有反射精修至晶体学R因子为16.0%。与氧化形式相比,1型铜位点的几何结构未改变。桥接铜原子CU2和CU3的氧配体也丢失了。过氧化物以氢过氧化物的形式末端结合到铜离子CU2上。铜离子CU2以扭曲的四面体几何结构与三个组氨酸残基中的NE2原子以及末端结合的过氧化物分子的氧原子形成四重配位。铜离子CU3如在还原形式中一样形成三重配位,并且围绕铜原子CU4的配位未改变。CU2-CU3的铜-铜距离增加到4.8 Å,CU2-CU4的铜-铜距离增加到4.5 Å。CU3-CU4的距离保持为3.7 Å。用过氧化物处理会导致铜离子CU2部分消耗。抗坏血酸氧化酶叠氮化物衍生物的精修在8.0 Å至2.