Bourgeat-Lami E, Lang J
Institut Charles Sadron (CRM-EAHP), CNRS-ULP Strasbourg, 6, rue Boussingault, Strasbourg Cedex, 67083, France
J Colloid Interface Sci. 1998 Jan 15;197(2):293-308. doi: 10.1006/jcis.1997.5265.
Polymer encapsulation of small silica particles, using dispersion polymerization of styrene in aqueous ethanol medium with poly(N-vinyl pyrrolidone) (PVP) as stabilizer, is described. Silica particles, directly synthesized by the Stober process in an aqueous ethanol medium, are either unreacted (hydrophilic character) or coated with 3-(trimethoxysilyl)propyl methacrylate (MPS) (hydrophobic character), which is grafted at the silica particle surface. When the bare silica particles are used as the seed, there is a strong tendency of the silica beads to cover the surface of the polystyrene particles and obviously encapsulation does not occur. On the contrary, when the silica surface is made hydrophobic by coating, the inorganic particles are entirely contained in the polystyrene particles as evidenced by microscopy techniques (TEM, SEM, AFM). It is shown that some polystyrene chains are then chemically bonded to the silica particles, through the coupling agent MPS, and that only a small amount of bonded polystyrene, compared to the total polystyrene synthesized, is sufficient to obtain encapsulation of the silica particles with the entire amount of polystyrene synthesized during the polymerization. Under our experimental conditions, each polystyrene latex particle contains, on average, 4 to 23 silica beads depending, in particular, on the size of the silica. We believe that it is possible to control the composite particle size and morphology by a convenient choice of the composition of the system. Moreover, this new polymer-encapsulation process could be used to synthesize other organic-inorganic composite particles, using, for example, other monomers or minerals. Copyright 1998 Academic Press. Copyright 1998Academic Press
本文描述了在乙醇水溶液介质中,以聚(N-乙烯基吡咯烷酮)(PVP)为稳定剂,通过苯乙烯分散聚合对小二氧化硅颗粒进行聚合物封装的过程。二氧化硅颗粒是在乙醇水溶液介质中通过斯托伯法直接合成的,要么未反应(具有亲水性),要么涂覆有甲基丙烯酸3-(三甲氧基硅基)丙酯(MPS)(具有疏水性),MPS接枝在二氧化硅颗粒表面。当使用裸露的二氧化硅颗粒作为种子时,二氧化硅珠粒有强烈的覆盖聚苯乙烯颗粒表面的趋势,显然不会发生封装。相反,当通过涂覆使二氧化硅表面具有疏水性时,显微镜技术(TEM、SEM、AFM)证明无机颗粒完全包含在聚苯乙烯颗粒中。结果表明,一些聚苯乙烯链通过偶联剂MPS化学键合到二氧化硅颗粒上,与合成的总聚苯乙烯相比,只有少量键合的聚苯乙烯就足以在聚合过程中用合成的全部聚苯乙烯对二氧化硅颗粒进行封装。在我们的实验条件下,每个聚苯乙烯胶乳颗粒平均含有4至23个二氧化硅珠粒,这尤其取决于二氧化硅的尺寸。我们认为,通过方便地选择体系组成,可以控制复合颗粒的尺寸和形态。此外,这种新的聚合物封装工艺可用于合成其他有机-无机复合颗粒,例如使用其他单体或矿物质。版权所有1998年学术出版社。版权所有1998年学术出版社