Ward G J, Mizrahi E, Cleaton-Jones P E
MRC/University of the Witwatersrand Dental Research Institute, South Africa.
Br J Orthod. 1998 May;25(2):123-6. doi: 10.1093/ortho/25.2.123.
Electrothermal bonding is based on acceleration of the setting reaction of a bonding: resin by the selective application of heat to the orthodontic bracket through the passage of a low voltage electric current. The purpose of this study was to compare the shear bond strength of nine resins comprising chemically-cured, light-cured, and glass ionomer types, 14 days after electrothermal and conventional bonding. Mean shear and bond strengths ranged from a low of 7.4 MPa for Sequence (electrothermally bonded) to a high of 15.4 MPa Concise (control). There was no statistically significant difference between the electrothermal and conventional bonding methods. All the resins produced bond strengths adequate for clinical orthodontics at 14 days.
电热粘结是基于通过低电压电流的传导,有选择地对正畸托槽施加热量,从而加速粘结树脂的固化反应。本研究的目的是比较电热粘结和传统粘结14天后,九种化学固化、光固化和玻璃离子类型树脂的剪切粘结强度。平均剪切粘结强度范围从Sequence(电热粘结)的7.4MPa低值到Concise(对照)的15.4MPa高值。电热粘结和传统粘结方法之间没有统计学上的显著差异。所有树脂在14天时产生的粘结强度足以用于临床正畸。