汞合金与复合嵌体之间界面粘结强度的评估。
Evaluation of interfacial bond strengths between amalgam and composite inlay.
作者信息
Abdel-Aziz A H, Alhadainy H A
机构信息
Department of Restorative Dentistry, College of Dentistry, University of Tanta, Egypt.
出版信息
Am J Dent. 1998 Jun;11(3):131-3.
PURPOSE
To evaluate the interfacial bond strengths between two amalgam alloys and an inlay resin composite bonded with two different luting agents.
MATERIALS AND METHODS
Inlay composites (EOS) were bonded with two different bonding systems (Geristore, All-Bond 2) to high- or low-copper amalgams (Valiant, Agestan). All tested specimens were thermocycled (100 cycles), tested for tensile bond strength and compared by ANOVA (P < 0.05).
RESULTS
Bond strengths varied from 5.3 to 11.4 MPa, with Geristore bonded to high-copper amalgam providing the highest strength.
目的
评估两种汞合金与用两种不同粘结剂粘结的嵌体树脂复合材料之间的界面粘结强度。
材料与方法
嵌体复合材料（EOS）用两种不同的粘结系统（Geristore、全粘结剂2型）与高铜或低铜汞合金（勇士、阿格斯丹）粘结。所有测试样本进行热循环（100次循环），测试拉伸粘结强度，并通过方差分析进行比较（P<0.05）。
结果
粘结强度在5.3至11.4兆帕之间变化，其中Geristore粘结到高铜汞合金上的强度最高。
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